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BORLAND WILLIAM J

Overview
  • Total Patents
    13
About

BORLAND WILLIAM J has a total of 13 patent applications. Its first patent ever was published in 2004. It filed its patents most often in United States. Its main competitors in its focus markets electrical machinery and energy, audio-visual technology and semiconductors are ENDICOTT INTERCONNECT TECH INC, KARIYA TAKASHI and CHEN TSUNG-YUAN.

Patent filings in countries

World map showing BORLAND WILLIAM Js patent filings in countries
# Country Total Patents
#1 United States 13

Patent filings per year

Chart showing BORLAND WILLIAM Js patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Borland William J 13
#2 Maria Jon-Paul 5
#3 Ihlefeld Jon Fredrick 2
#4 Burn Ian 2
#5 Suh Seigi 2
#6 Renovales Olga L 2
#7 Glicksman Howard David 2
#8 Dueber Thomas E 1
#9 Majumdar Diptarka 1
#10 Amey Daniel Irwin 1

Latest patents

Publication Filing date Title
US2012085401A1 Processes and compositions for forming photovoltaic devices with base metal buss bars
US2010154875A1 Compositions and processes for forming photovoltaic devices
US2010037942A1 Processes for forming photovoltaic devices
US2008037198A1 Methods of forming individual formed-on-foil thin capacitors for embedding inside printed wiring boards and semiconductor packages
US2008010798A1 Thin film dielectrics with co-fired electrodes for capacitors and methods of making thereof
US2007236859A1 Organic encapsulant compositions for protection of electronic components
US2006287188A1 Manganese doped barium titanate thin film compositions, capacitors, and methods of making thereof
US2006141225A1 Oxygen doped firing of barium titanate on copper foil
US2006120015A1 Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards
US2005204864A1 Thick-film dielectric and conductive compositions