ASPERATION OY has a total of 30 patent applications. Its first patent ever was published in 2003. It filed its patents most often in Finland, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets audio-visual technology, telecommunications and optics are SHANGHAI MEADVILLE SCIENCE & TECHNOLOGY CO LTD, VIASYSTEMS GROUP INC and MITTWEIDA ING HOCHSCHULE.
# | Country | Total Patents | |
---|---|---|---|
#1 | Finland | 9 | |
#2 | WIPO (World Intellectual Property Organization) | 8 | |
#3 | China | 6 | |
#4 | Australia | 2 | |
#5 | United States | 2 | |
#6 | Brazil | 1 | |
#7 | Mexico | 1 | |
#8 | Sweden | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Telecommunications | |
#3 | Optics | |
#4 | Digital networks | |
#5 | Semiconductors | |
#6 | Machines |
# | Technology | |
---|---|---|
#1 | Casings and printed circuits | |
#2 | Loudspeakers and microphones | |
#3 | Transmission | |
#4 | Optical systems | |
#5 | Semiconductor devices | |
#6 | Digital information transmission | |
#7 | Unspecified technologies | |
#8 | Antennas |
# | Name | Total Patents |
---|---|---|
#1 | Von Lerber Tuomo | 9 |
#2 | Hietala Joni | 8 |
#3 | Kutilainen Terho | 6 |
#4 | Muukkonen Esa | 5 |
#5 | Penttinen Auvo | 4 |
#6 | Uusikartano Matti | 4 |
#7 | Paarni Hannu | 3 |
#8 | Auvo Penttinen | 2 |
#9 | Sjoeblom Peter | 2 |
#10 | Paeaerni Hannu | 1 |
Publication | Filing date | Title |
---|---|---|
FI20055251A0 | Method of providing a lighting arrangement for a portable terminal, lighting arrangement for a portable terminal and a portable terminal | |
FI20055125A0 | Lighting arrangement for a portable terminal and portable terminal | |
WO2005052659A1 | A circuit board and a method for its manufacture | |
FI20040253A0 | Circuit board and method for immersing an optical component in a circuit board | |
FI20045004A0 | Optical channel structure and method for manufacturing the same and circuit boards | |
FI20031796A0 | A method of constructing an EMI shield around a component to be embedded in a circuit board | |
FI20035115A0 | Method for transmitting signals in a circuit board as well as circuit boards | |
FI20030945A0 | Electromechanical transor and manufacturing process | |
FI20035075A0 | Method for manufacturing a circuit board and a circuit board | |
CN1659925A | An acoustically active element formed in a multi-layer circuit-board structure, a method for forming acoustically active element in a multi-layer circuit-board structure, and a multi-layer circuit-boa |