ASM INTERNAT NV has a total of 17 patent applications. Its first patent ever was published in 1996. It filed its patents most often in United States, Taiwan and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, surface technology and coating and control are JIANGSU HELIOS TECHNOLOGY CO LTD, ADVANCED MATERIAL TECHNOLOGIES INC and OLEDON CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 15 | |
#2 | Taiwan | 1 | |
#3 | WIPO (World Intellectual Property Organization) | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Surface technology and coating | |
#3 | Control | |
#4 | Environmental technology | |
#5 | Computer technology | |
#6 | Machines |
# | Name | Total Patents |
---|---|---|
#1 | Elers Kai-Erik | 4 |
#2 | Zinger Jan | 3 |
#3 | Soininen Pekka J | 2 |
#4 | Van Der Pol Marinus Jan | 2 |
#5 | Haanstra Kornelius | 2 |
#6 | Soininen Pekka Juha | 2 |
#7 | Raaijmakers Ivo | 2 |
#8 | Siegers Johan | 2 |
#9 | Saanila Ville Antero | 1 |
#10 | Kaipio Sari Johanna | 1 |
Publication | Filing date | Title |
---|---|---|
US2009325391A1 | Ozone and teos process for silicon oxide deposition | |
US2004034448A1 | Method and system for using short ranged wireless enabled computers as a service tool | |
US2004004636A1 | Method for the automatic generation of an interactive electronic equipment documentation package | |
US6843201B2 | Temperature control for single substrate semiconductor processing reactor | |
US2003149506A1 | Method and system to process semiconductor wafers | |
US2003090522A1 | Graphical representation of a wafer processing process | |
US6878628B2 | In situ reduction of copper oxide prior to silicon carbide deposition | |
US6780704B1 | Conformal thin films over textured capacitor electrodes |