| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Republic of Korea | 11 | |
| #2 | China | 4 | |
| #3 | Japan | 1 |
| # | Name | Total Patents |
|---|---|---|
| #1 | Park Seung Beom | 8 |
| #2 | Kim Jong Je | 6 |
| #3 | Kim Hyun Jin | 5 |
| #4 | Park Seung Bum | 4 |
| #5 | Kim Jong Sik | 4 |
| #6 | Kim Jong Jae | 3 |
| #7 | Kim Jong-Sik | 1 |
| #8 | Dong Tianxing | 1 |
| #9 | Lai Junji | 1 |
| #10 | Kim Hyun-Jin | 1 |
| Publication | Filing date | Title |
|---|---|---|
| KR20200117678A | A apparatus for attaching flexible panel to the curved material | |
| KR20190127402A | A electrostatic chuck comprising a protecting coating layer | |
| KR101964631B1 | A electrostatic chuck | |
| CN108268991A | Factory's processing procedure dynamic screening methods in running | |
| KR20130103841A | Method for recycling the carbon-chuck | |
| KR20120078115A | Wire bonding apparatus | |
| KR20120071853A | Wire bonding apparatus and method | |
| KR20090052311A | Chuck | |
| KR20100036039A | Chuck | |
| KR20090054789A | Chuck | |
| KR20090040138A | Chuck | |
| KR20080041774A | Chuck for attaching substrate and apparatus having the same |