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ANHUI BEIFANG XINDONG LIANKE MICROSYSTEM TECHNOLOGY CO LTD

Overview
  • Total Patents
    11
  • GoodIP Patent Rank
    184,944
About

ANHUI BEIFANG XINDONG LIANKE MICROSYSTEM TECHNOLOGY CO LTD has a total of 11 patent applications. Its first patent ever was published in 2013. It filed its patents most often in China. Its main competitors in its focus markets measurement, semiconductors and micro-structure and nano-technology are SENODIA TECHNOLOGIES SHANGHAI CO LTD, SENODIA TECH SHANGHAI CO LTD and VTI TECHNOLOGIES OY.

Patent filings in countries

World map showing ANHUI BEIFANG XINDONG LIANKE MICROSYSTEM TECHNOLOGY CO LTDs patent filings in countries
# Country Total Patents
#1 China 11

Patent filings per year

Chart showing ANHUI BEIFANG XINDONG LIANKE MICROSYSTEM TECHNOLOGY CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hua Yaping 11
#2 Lu Feng 1
#3 Gu Haoqi 1
#4 Shi Zhenqi 1

Latest patents

Publication Filing date Title
CN104966689A Wafer level packaging MEMS (Micro-Electro-Mechanical Systems) chip uncovering device and uncovering method
CN104692319A Manufacturing method of MEMS chip insensitive to packaging stress and MEMS chip
CN104344838A Property testing device and testing method thereof for six-axis MEMS (micro-electromechanical system) movement sensor
CN104198763A TSV (through silicon via) wafer-level packaged triaxial MEMS (micro-electro-mechanical systems) accelerometer
CN104124183A Device and method for analyzing failures of TSV (through silicon via) wafer level packaged MEMS (micro-electro-mechanical systems) chips
CN104121898A Test device for triaxial microelectronic compass and test method thereof
CN103922273A Method for manufacturing laminated composite MEMS(Micro-electromechanical Systems)chips and laminated composite MEMS chip
CN103552980A Wafer level packaging method for micro electromechanical system (MEMS) chip and single-chip micro-miniature type MEMS chip
CN103389112A Testing device and testing method of mini triaxial gyroscope
CN103245799A Correcting device and correcting method of multi-axis miniature motion sensor
CN103193198A Method for reducing packaging stress of micro-electromechanical system (MEMS) chip through back graphics