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ANAM IND CO LTD

Overview
  • Total Patents
    105
About

ANAM IND CO LTD has a total of 105 patent applications. Its first patent ever was published in 1991. It filed its patents most often in Republic of Korea and United States. Its main competitors in its focus markets semiconductors, machines and audio-visual technology are KOSHIBE SHIGERU, NIPPON RETSUKU KK and YAMANO TAKAHARU.

Patent filings in countries

World map showing ANAM IND CO LTDs patent filings in countries
# Country Total Patents
#1 Republic of Korea 90
#2 United States 15

Patent filings per year

Chart showing ANAM IND CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lee Koo 9
#2 Lee Kyu-Hyung 8
#3 Sim Ill-Kwon 6
#4 Shin Won-Sun 6
#5 Hu Young-Wook 6
#6 Lee Sang-Duk 6
#7 Kim Jong-Hwan 6
#8 Kim Myung-Ill 5
#9 Sonn Joo-Young 4
#10 Han Kyung-Hee 4

Latest patents

Publication Filing date Title
US5637273A Method for molding of integrated circuit package
US5807768A Method for fabricating a heat sink-integrated semiconductor package
US5760498A Power drawing circuit for two-wire switching unit
US5661338A Chip mounting plate construction of lead frame for semiconductor package
US5712570A Method for checking a wire bond of a semiconductor package
KR0159985B1 Semiconductor package heat sink structure
KR0145995B1 PLOCK OF SETTING STRIPMEMBERS SEMICONDUCTOR PAcKAGING EQUIPMENT
KR0165601B1 Die set structure of semiconductor manufacture apparatus
KR0156472B1 Dambar cutting of leadframe and the structure
KR0142135B1 The de tape method of the tape interfering plating on the heatsink of the semiconductor package
KR0167141B1 Semiconductor package
KR0167145B1 Semiconductor package type mold precision structure
KR0137814B1 Tubular feeding method
KR0138840B1 Forming machine
KR0143020B1 Transfer loader of coating apparatus for semiconductor package
KR0167144B1 Lead frame transfer method of coating system
KR0167143B1 Coating cover method to chip surface
KR0139266B1 Method of semiconductor package coating system
KR0167142B1 Coating device of package coating system
KR0127785B1 Semiconductor package gate curl removing device