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ADVANCED THERMAL TECHNOLOGIES

Overview
  • Total Patents
    13
About

ADVANCED THERMAL TECHNOLOGIES has a total of 13 patent applications. Its first patent ever was published in 1997. It filed its patents most often in United States, Taiwan and China. Its main competitors in its focus markets semiconductors, thermal processes and materials and metallurgy are NAKAGAWA YOSHIHIRO, LEE DONG GYU and KONDOH IND LTD.

Patent filings in countries

World map showing ADVANCED THERMAL TECHNOLOGIESs patent filings in countries
# Country Total Patents
#1 United States 8
#2 Taiwan 3
#3 China 2

Patent filings per year

Chart showing ADVANCED THERMAL TECHNOLOGIESs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lee Tzung-Lung 4
#2 Lin Ming-Chen 3
#3 Yoho Sr Robert W 2
#4 Li Tzung-Lung 2
#5 Li Zonglong 2
#6 Lin Mingcheng 1
#7 Tsai Bo-Bin 1
#8 Lin Jackie 1

Latest patents

Publication Filing date Title
US2005150633A1 Heat sink and method for manufacturing the same
US2005133908A1 Chip assembly with glue-strengthening holes
CN1628920A Composite radiator manufacturing method
CN1622318A Manufacturing method and structure for radiator
US6803654B1 Heat-radiating device of chip
US6681847B1 Radiator fin formed by sintering operation
TW573025B Carbon-containing copper complex material with variable thermal-expansion coefficient and the use thereof
US6487077B1 Heat dissipating device adapted to be applied to a flip chip device
TW503690B Heat sink sheet formed by sintering
US6418020B1 Heat dissipation device with ribbed fin plates
TW447098B Manufacturing method for heat sink table of IC and the device thereof
US5931016A Air conditioning system having multiple energy regeneration capabilities
US5937667A System for the dehumidification of cooled air