A B MIKROELEKTRONIK GES MIT BESCHRAENKTER HAFTUNG has a total of 11 patent applications. It increased the IP activity by 0.0%. Its first patent ever was published in 2013. It filed its patents most often in WIPO (World Intellectual Property Organization), United States and China. Its main competitors in its focus markets electrical machinery and energy, semiconductors and transport are ZHANG LEILEI, HAEUSERMANN GMBH and XICON AB.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 5 | |
#2 | United States | 3 | |
#3 | China | 1 | |
#4 | Germany | 1 | |
#5 | EPO (European Patent Office) | 1 |
# | Industry | |
---|---|---|
#1 | Electrical machinery and energy | |
#2 | Semiconductors | |
#3 | Transport | |
#4 | Audio-visual technology | |
#5 | Environmental technology |
# | Name | Total Patents |
---|---|---|
#1 | Tusler Wolfgang | 5 |
#2 | Haegele Bernd | 3 |
#3 | Burns Robert Christopher | 3 |
#4 | Zippel Martin | 2 |
#5 | Schlosser Andreas | 2 |
#6 | Rohm Sebastian | 2 |
#7 | Costa Louis | 2 |
#8 | Barb Horia | 1 |
#9 | Traintinger Peter | 1 |
#10 | Kandler Markus | 1 |
Publication | Filing date | Title |
---|---|---|
WO2020220060A1 | Electronic power module | |
WO2020146914A2 | Methods of laser pretreating or processing a metal substrate for use in power electronic device | |
WO2019232564A1 | Method and system for controlling an electric motor and detecting a stall condition | |
WO2019165488A1 | Chip scale package light emitting diode module for automotive lighting applications | |
DE102018006054A1 | Device for at least partially discharging an electrical energy store | |
US2015364384A1 | Placement method for circuit carrier and circuit carrier |