3S SILICON TECH INC has a total of 11 patent applications. It increased the IP activity by 200.0%. Its first patent ever was published in 2011. It filed its patents most often in Taiwan, China and EPO (European Patent Office). Its main competitors in its focus markets machine tools, audio-visual technology and semiconductors are XSIL TECHNOLOGY LTD, GERINGER MICHAEL and JENNINGS DEAN.
# | Country | Total Patents | |
---|---|---|---|
#1 | Taiwan | 4 | |
#2 | China | 3 | |
#3 | EPO (European Patent Office) | 3 | |
#4 | Japan | 1 |
# | Industry | |
---|---|---|
#1 | Machine tools | |
#2 | Audio-visual technology | |
#3 | Semiconductors | |
#4 | Chemical engineering |
# | Technology | |
---|---|---|
#1 | Soldering, welding and flame cutting | |
#2 | Casings and printed circuits | |
#3 | Semiconductor devices | |
#4 | Boiling machines |
# | Name | Total Patents |
---|---|---|
#1 | Peng Jung-Kuei | 5 |
#2 | Huang Cheng-Shang | 5 |
#3 | Wu Mao-Jung | 3 |
#4 | Chen Guo-Hui | 3 |
#5 | Wu Chuan-Jen | 3 |
#6 | Zhan Shang-Qing | 2 |
#7 | Huang Wen-Ting | 2 |
#8 | Yeh Kuo-Liang | 2 |
#9 | Zhuang Shu-Zhen | 2 |
#10 | Wen Yude | 2 |
Publication | Filing date | Title |
---|---|---|
EP3782710A1 | Pure formic acid gas supplying device, pure-formic-acid-gas-supplied soldering system, and method for supplying pure formic acid gas | |
EP3750657A1 | Vacuum reflow oven | |
TW201918307A | Vacuum soldering furnace improving the soldering strength, reducing the resistance value of the solder layer, and stabilizing the quality of the soldering process | |
TW201404508A | Vacuum reflow soldering apparatus and vacuum reflow soldering method | |
TW201349315A | PN junction protection method for diode/transistor chip | |
TW201250849A | Low-temperature chip bonding method for light-condensing type solar chip, power transistor and field effect transistor |