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YUKA SANSHO KENZAI KK

Overview
  • Total Patents
    36
  • GoodIP Patent Rank
    204,889
  • Filing trend
    ⇩ 100.0%
About

YUKA SANSHO KENZAI KK has a total of 36 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2003. It filed its patents most often in Japan. Its main competitors in its focus markets civil engineering are SCHNELL ANTON, CECON INT NV and KIRII CONSTRUCTION MATERIALS C.

Patent filings in countries

World map showing YUKA SANSHO KENZAI KKs patent filings in countries
# Country Total Patents
#1 Japan 36

Patent filings per year

Chart showing YUKA SANSHO KENZAI KKs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Civil engineering

Focus technologies

Top inventors

# Name Total Patents
#1 Miyamoto Nobuyuki 26
#2 Ito Teruo 13
#3 Suzuki Osamu 7
#4 Tsuganezawa Satoru 5
#5 Taga Makoto 4
#6 Kagitani Masaru 3
#7 Mishima Nobumasa 2
#8 Amada Masahiro 2
#9 Kano Chiaki 1
#10 Fujimoto Koichi 1

Latest patents

Publication Filing date Title
JP2018134598A Injection device of hard urethane foam
JP2017203262A Installation method of floor substrate material, and support leg
JP2017074680A Hard urethane foam injection device
JP2016023491A Laying method for underfloor material
JP2011084983A Structure of floor backing
JP2010261184A Tatami mat floor as building material and tatami mat placed thereon
JP2010255357A Double heat-insulating panel
JP2010150871A Decorative plate attaching method for thermal insulation material doubling as form and latching member for outer wall
JP2010121369A Heat insulating material serving also as form, and method of level adjustment of the same
JP2009287240A Method of forming heat insulating board
JP2009287239A Floor structure and its construction method
JP2009249862A Method of installing floor substrate
JP2009249864A Method of installing floor substrate
JP2009052388A Sub-floor material and its setting method
JP2009046965A Heat reserving plate and its installation method
JP2009041302A Plate member
JP2008223232A Partition plate and partition wall
JP2008223231A Lightweight embedded material
JP2007255180A Composite for unevenness adjustment, unevenness adjusting member, and construction method of floor structure using unevenness adjusting member
JP2008095390A Floor structure and its construction method