| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 7 | |
| #2 | WIPO (World Intellectual Property Organization) | 7 | |
| #3 | Republic of Korea | 6 | |
| #4 | United States | 4 | |
| #5 | EPO (European Patent Office) | 3 | |
| #6 | Taiwan | 2 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Audio-visual technology | |
| #3 | Packaging and shipping | |
| #4 | Thermal processes |
| # | Technology | |
|---|---|---|
| #1 | Soldering, welding and flame cutting | |
| #2 | Casings and printed circuits | |
| #3 | Transport or storage devices | |
| #4 | Details of furnaces | |
| #5 | Packaging |
| # | Name | Total Patents |
|---|---|---|
| #1 | Yokota Yatsuharu | 22 |
| #2 | Yamada Osamu | 5 |
| #3 | Osamu Yamada | 1 |
| #4 | Yatsuharu Yokote | 1 |
| Publication | Filing date | Title |
|---|---|---|
| CN104115573A | Heat processing device | |
| CN103891422A | Conveyor | |
| WO2013031739A1 | Conveyor | |
| WO2012164776A1 | Soldering device | |
| KR20130114184A | Reflow soldering apparatus and method therefor | |
| CN101472401A | Reflow furnace | |
| WO2006075803A1 | Reflow furnace | |
| US2005178814A1 | Reflow soldering apparatus |