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YESUN SHANGHAI MOULD CO LTD

Overview
  • Total Patents
    15
  • GoodIP Patent Rank
    215,343
About

YESUN SHANGHAI MOULD CO LTD has a total of 15 patent applications. Its first patent ever was published in 2011. It filed its patents most often in China. Its main competitors in its focus markets machine tools are HITACHI HIGASHI SERVICE ENG KK, MARUMASU KIKAI KK and ANHUI PROVINCE ELITE HOUSEHOLD APPLIANCES MFG EQUIPMENT CO LTD.

Patent filings in countries

World map showing YESUN SHANGHAI MOULD CO LTDs patent filings in countries
# Country Total Patents
#1 China 15

Patent filings per year

Chart showing YESUN SHANGHAI MOULD CO LTDs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Machine tools

Focus technologies

# Technology
#1 Punching metal

Top inventors

# Name Total Patents
#1 Xu Haimei 6
#2 Zhou Ping 5
#3 Zhao Bin 4
#4 Le Xugang 4
#5 Wang Lijun 4
#6 Qi Li 3
#7 Li Zheng 2
#8 Wan Zhen 2
#9 Cui Lin 2
#10 Bin Zhao 1

Latest patents

Publication Filing date Title
CN111906191A Modularized and shared die
CN111804824A Door sheet water cutting upper pre-bending pressing method
CN103480733A Double-action double-angle lateral shaping mechanism
CN103418656A Method for stamping automobile beam piece
CN103418675A Automobile outer plate processing technic method
CN103406445A Circular arc whole circle side flanging moving mechanism
CN103406414A Molding switching mechanism
CN103433368A Mechanism for finishing upturning and trimming of outer covering member of automobile in one process
CN103418695A Pneumatic type time-delay mechanism for stamping
CN103433361A Rotary pulling and stamping mechanism used for stamping
CN103433376A Independent switching mechanism for stamping die
CN102319803A A kind of process and mould thereof that draws the flange moulding
CN102319810A Punching mold time delay falling mechanism
CN102354148A Method for carrying out interference inspection on moulds based on assembling
CN102284624B Swaging mechanism for improving forming height and precision of hole flanging and application thereof