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YAYATECH CO LTD

Overview
  • Total Patents
    36
  • GoodIP Patent Rank
    115,586
  • Filing trend
    ⇩ 33.0%
About

YAYATECH CO LTD has a total of 36 patent applications. It decreased the IP activity by 33.0%. Its first patent ever was published in 2007. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets measurement, semiconductors and optics are TAKEDA KAZUO, BIOCHROM LTD and STAT PEEL AG.

Patent filings in countries

World map showing YAYATECH CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 25
#2 China 8
#3 United States 2
#4 Japan 1

Patent filings per year

Chart showing YAYATECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yan Shuo-Ting 7
#2 Chen Yi-Chien 5
#3 Chen Li-Chueh 5
#4 Hong Wei-Li 5
#5 Wang Si-Hao 4
#6 Chen Yi Chien 4
#7 Zheng Rui-Feng 4
#8 Lin Sheng-Feng 4
#9 Chen Li Chueh 4
#10 Lin En-Ning 3

Latest patents

Publication Filing date Title
CN111983884A Chip inner and outer layer image capturing device
CN111942930A Electronic element material belt conveying device
TW202043558A Wafer inner and outer layer imaging device including a first camera set, a second camera set, a light source, a beam splitter group and an objective lens
TW202042325A Conveying device for electronic component tape can maintain the flatness and stability of the electronic component tape while conveying
TW202036805A IC strip pressing device and track combination including a track, a frame plate and elastic pressing wheel sets
TW202036007A Classification system and method for inspected non-defective/defective ICs disposing a to-be-classified area, a temporary area and a defective product area to respectively accommodate the trays
TW201931973A Punching verification machine with pressing function capable of ensuring the flatness of a board to be verified thereby guaranteeing an excellent verification result
TW201928374A IC inspection machine with temporary fixing effect characterized by taking images from the bottom to the top through a hollow part
TW201917377A Method for inspecting positioning of holed steel plate a coordinate of a reference hole relative to a steel plate is calculated according to the length and the width of the steel plate, the radius of an area-to-be-inspected, and the distance of the reference hole relative to the X-axis
TW201905420A Steel plate inspection machine comprising a base, a carrying unit, a clamping assembly, an inspection unit, and a correction unit
TW201818486A Lens shell assembly of wafer inspection equipment capable of preventing chips on inspected wafer from being detached from dicing tape or colliding with each other
TW201814803A Cleaning device of wafer inspection equipment for reducing residue solution left on back of wafer
TW201604534A High efficiency conveying module of inspection system
TW201448076A Liquid immersion apparatus and immersion method and wafer scribing lines inspection machine with liquid immersion apparatus
TW201423882A Inspection method and inspection fixture for scribing lines of wafer
TW201333415A Optical detecting appratus
TW201331570A Surface-scanning unit and optical detecting appratus having the same
TW201224452A Quantitation device for trace biological sample solution
CN101949886A Real-time fluorescence electrophoresis apparatus
TW201209390A Real-time fluorescent electrophoresis apparatus