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WUXI ZHONGWEI YIXIN CO LTD

Overview
  • Total Patents
    54
  • GoodIP Patent Rank
    27,219
  • Filing trend
    ⇩ 66.0%
About

WUXI ZHONGWEI YIXIN CO LTD has a total of 54 patent applications. It decreased the IP activity by 66.0%. Its first patent ever was published in 2014. It filed its patents most often in China. Its main competitors in its focus markets computer technology, semiconductors and basic communication technologies are ADVANCED MICRO DEVICES INC, ATMEL CORP and NUVOTON TECHNOLOGY CORP.

Patent filings in countries

World map showing WUXI ZHONGWEI YIXIN CO LTDs patent filings in countries
# Country Total Patents
#1 China 54

Patent filings per year

Chart showing WUXI ZHONGWEI YIXIN CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Xu Yanfeng 35
#2 Yan Hua 35
#3 Shan Yue'Er 32
#4 Zhang Yanfei 29
#5 Fan Jicong 26
#6 Hui Feng 10
#7 Yu Jian 10
#8 Chen Boyin 7
#9 Dong Zhidan 6
#10 Liu Pei 5

Latest patents

Publication Filing date Title
CN112147492A Novel testability structure of lookup table
CN112131811A FPGA time sequence parameter extraction method
CN112183013A Novel FPGA chip layout optimization method
CN112149376A FPGA layout legalization method based on maximum flow algorithm
CN112183014A Force guiding layout method for carrying out crowded area expansion based on maximum flow algorithm
CN112131814A FPGA layout legalization method utilizing regional re-layout
CN112131813A FPGA wiring method for improving wiring speed based on port exchange technology
CN111722097A Multi-die FPGA with interconnection test function
CN111753487A FPGA device with power-on reset signal waveform adjustable function
CN111725188A Multi-die FPGA with silicon connection layer provided with configurable circuit
CN111755436A Multi-die FPGA with real-time monitoring and configuration information correcting functions
CN111753477A Multi-die FPGA for realizing system monitoring by utilizing active silicon connection layer
CN111755435A Multi-die FPGA for integrating HBM memory dies by utilizing silicon connection layer
CN111679615A FPGA device internally integrating network-on-chip with different bit width connecting lines
CN111710662A Universal multi-die silicon stacking interconnection structure
CN111710663A Multi-die silicon stacking interconnection structure FPGA
CN111710659A Silicon connection layer test circuit for testing by using test bare chip
CN111725187A Multi-bare-chip FPGA (field programmable Gate array) formed based on silicon connection layer with universal structure
CN111753479A Multi-die FPGA for integrating multi-die network-on-chip using silicon connection layer
CN111753480A Multi-die FPGA for implementing clock tree by using active silicon connection layer