|
CS587890A3
|
|
Epoxyacrylate composition
|
|
CS174490A3
|
|
Reactive composition
|
|
CS174590A3
|
|
Reactive composition
|
|
CS348589A3
|
|
Hardenable pouring floor covering
|
|
CS348489A3
|
|
Composition for electrically-conducting plastic mortars and cements
|
|
CZ116389A3
|
|
Composition, particularly for penetrations, impregnations and injections of porous materials
|
|
CS832088A1
|
|
Thermooxidatively stabilized diane
|
|
CS831888A1
|
|
Thermooxidatively stabilized diane
|
|
CS831988A1
|
|
Thermooxidatively stabilized diane
|
|
CS827088A1
|
|
Curing agent for epoxy compositions
|
|
CS827188A1
|
|
Setting agent with increased reactivity
|
|
CS827288A1
|
|
Composition especially for materials with increased chemical resistance
|
|
CS529788A1
|
|
Composition especially for high-strong composites and solventless penetrants
|
|
CS529688A1
|
|
Method of low-molecular epoxy resins production
|
|
CS427388A1
|
|
Epoxy composition especially for building work's spil till grindable electrostatically conductive coatings
|
|
CS427588A1
|
|
Thixotropic epoxy composition
|
|
CS427488A1
|
|
Epoxy composition especially for cast floors
|
|
CS427188A1
|
|
Method of high-molecular epoxy resins preparation with content of free epichlorohydrin under 20 ppm
|
|
CS707087A1
|
|
Epoxy resin on the base of diane with modified time of workability
|
|
CS533487A1
|
|
Aminoamide resin
|
