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VENTEC ELECTRONICS SUZHOU CO LTD

Overview
  • Total Patents
    11
  • GoodIP Patent Rank
    189,411
  • Filing trend
    ⇩ 100.0%
About

VENTEC ELECTRONICS SUZHOU CO LTD has a total of 11 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2008. It filed its patents most often in China and United States. Its main competitors in its focus markets machines, macromolecular chemistry and polymers and surface technology and coating are YOUNGBO CHEMICAL CO LTD, NMC SA and FUJIAN XIANGLONG PLASTIC CO LTD.

Patent filings in countries

World map showing VENTEC ELECTRONICS SUZHOU CO LTDs patent filings in countries
# Country Total Patents
#1 China 10
#2 United States 1

Patent filings per year

Chart showing VENTEC ELECTRONICS SUZHOU CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Zhuo 6
#2 Zhong Jianren 5
#3 Daixin Peng 4
#4 Zou Shuiping 4
#5 Zhuo Wang 3
#6 Jianren Zhong 3
#7 Jianfang Zhang 2
#8 Juan Wang 2
#9 Zhang Guyu 1
#10 Wang Kai 1

Latest patents

Publication Filing date Title
CN111844824A Preparation method of PTFE composite material sheet, PTFE composite material sheet and copper-clad plate using PTFE composite material sheet
CN111976164A Preparation method of polytetrafluoroethylene-based metal substrate and metal substrate
CN111823619A Preparation method of PTFE composite material film, PTFE film and copper-clad plate using PTFE film
CN109718711A A kind of polyimides homogeneous system
CN109777103A A kind of low flow prepreg and preparation method thereof
US2018201809A1 Fluorinated vinyl polymer resin composition, prepreg and laminate materials containing the same
CN101808466A Manufacturing method of copper-clad plate and glue solution for copper-clad plate
CN101654543A Epoxy resin composition
CN101445643A Epoxy resin composite
CN101376734A Epoxide-resin glue liquid, laminated board for printed circuit board manufactured by using the same and manufacturing method thereof
CN101343401A Halogen-free glue solution, halogen-free flame-proof cover copper foil substrate using the glue solution and preparation method thereof