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UNIV NANYANG

Overview
  • Total Patents
    300
About

UNIV NANYANG has a total of 300 patent applications. Its first patent ever was published in 1995. It filed its patents most often in WIPO (World Intellectual Property Organization), United States and Singapore. Its main competitors in its focus markets medical technology, measurement and machines are ECOLE POLYTECH, UNIV NANYANG TECH and UNIV EINDHOVEN TECH.

Patent filings per year

Chart showing UNIV NANYANGs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lam Yee Loy 17
#2 Shi Xu 15
#3 Boey Yin Chiang 15
#4 Tan Hong Siang 15
#5 Ser Wee 14
#6 Zhang Ming 14
#7 Tay Beng Kang 12
#8 Ma Jan 11
#9 Yau Wei Yun 11
#10 Tjin Swee Chuan 11

Latest patents

Publication Filing date Title
WO2010132029A1 Octahydro biquinoline compound
WO2010093333A1 Multi-layered surgical prosthesis
CN102217072A Electronic device with channel, electrodes and semiconductor formed on respective bonded substrates
CN102210042A Electrode materials for metal-air batteries, fuel cells and supercapacitors
WO2010027334A1 Novel tricyclic chiral compounds and their use in asymmetric catalysis
WO2009139727A1 Circuit and method for generating a pulse signal
WO2009136870A1 Proton exchange membrane for fuel cell applications
WO2009105041A1 Dithienothiophene derivatives
WO2009078815A1 A nanostructured material loaded with noble metal particles
WO2009078813A1 Method of forming oseltamivir and derivatives thereof
WO2009113963A1 Method and use of providing photocatalytic activity
WO2009075652A1 Hollow multi-layered microspheres for delivery of hydrophilic active compounds
SG152167A1 A holographic microscope and a method of holographic microscopy
WO2010027325A1 Micro-emulsifier for arterial thrombus removal
CN101815563A Hollow porous microspheres
WO2009005476A1 Capillary sample separation apparatus
WO2008136769A1 Online contaminant detection and removal system
US2009248145A1 Method of forming a three-dimensional structure of unidirectionally aligned cells
WO2009120151A1 Membrane made of a nanostructured material
US2009236701A1 Chip arrangement and a method of determining an inductivity compensation structure for compensating a bond wire inductivity in a chip arrangement