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UNITED MICRODISPLAY OPTRONICS CORP

Overview
  • Total Patents
    57
About

UNITED MICRODISPLAY OPTRONICS CORP has a total of 57 patent applications. Its first patent ever was published in 2004. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets optics, electrical machinery and energy and semiconductors are BODLE TECH LIMITED, KURODA TATSURO and QUANTA DISPLAY JAPAN INC.

Patent filings in countries

World map showing UNITED MICRODISPLAY OPTRONICS CORPs patent filings in countries
# Country Total Patents
#1 Taiwan 23
#2 China 13
#3 United States 12
#4 Japan 9

Patent filings per year

Chart showing UNITED MICRODISPLAY OPTRONICS CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kuan Da-Shuang 16
#2 Lin Chia-Te 13
#3 Whitehead Tony 9
#4 Chan Chia-Tsung 9
#5 Kuan Ta-Shuang 9
#6 Dashuang Guan 8
#7 Kan Daiso 8
#8 Meng Chi-Tai 6
#9 Whitehead Anthony Joseph Jr 5
#10 Haku Toni 5

Latest patents

Publication Filing date Title
CN101576629A Colored light filter piece, manufacture method thereof and liquid crystal display containing same
JP2009063837A Multiple primary color digital light dividing and coupling system and method, and digital projector
CN101382726A Projection device
TW200909973A Projection apparatus
TW200903133A Multi-primary-color digital light splitting and combining system and method, and digital projector
US2009009726A1 Multi-primary-color digital light splitting and combining system and method, and digital projector
CN101201422A Method for preparing pattern film by divesting method
TW200826191A Method of fabricating patterned layer using lift-off process
US2008124823A1 Method of fabricating patterned layer using lift-off process
CN101191963A Electrode structure capable of reflecting coloring domain and monocrystalline silicon panel and display apparatus
TW200821718A Electrode structure capable of reflecting color light and LCOS panel and display apparatus
US2008106677A1 Electrode structure capable of reflecting color light and lcos panel
CN101162711A Packaging cover board, chip packaging structure and manufacturing method thereof
CN101153976A Manufacturing method and alignment method for LCD panel
TW200816403A Packaging cover panel, chip package structure and fabricating method thereof
TW200813573A Method of fabricating a liquid crystal panel and alignment method
US2008061425A1 Chip package structure and fabricating method thereof
US2008062376A1 Method of fabricating a liquid crystal panel and alignment method
TW200805701A Method of packaging light emitting diodes
JP2007328015A Method for manufacturing liquid crystal alignment layer