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ULTRA COMMUNICATIONS INC

Overview
  • Total Patents
    23
  • GoodIP Patent Rank
    164,642
  • Filing trend
    ⇧ 300.0%
About

ULTRA COMMUNICATIONS INC has a total of 23 patent applications. It increased the IP activity by 300.0%. Its first patent ever was published in 2009. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets optics, measurement and telecommunications are RADIANTECH INC, MOTIC IND GROUP CO LTD and COMMSCOPE ASIA HOLDINGS BV.

Patent filings in countries

World map showing ULTRA COMMUNICATIONS INCs patent filings in countries

Patent filings per year

Chart showing ULTRA COMMUNICATIONS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kuznia Charles B 21
#2 Ahadian Joseph F 18
#3 Pommer Richard J 14
#4 Hagan Richard T 14
#5 Wong Man W 6
#6 Ahadian Joseph Farzin 4
#7 Skendzic Sandra 3
#8 Kusumoto Kris 3
#9 Lenos Howard Arthur 2
#10 Weiss Richard J 1

Latest patents

Publication Filing date Title
US2020350986A1 Automated System for Link Health Assessment in Fiber Optic Networks
US2020309638A1 Bidirectional coupling optic
US2019353851A1 Fiber optic end-face transparent protector system and method
US10605995B1 Single-use disposable pod for application of an optical fiber protection device
US2015378108A1 Fiber optic end-face transparent protector
WO2013155263A1 Small form factor transceiver compatible with solder processing
US2015063760A1 Small form factor transceiver compatible with solder processing
WO2013162903A2 Optical time domain reflectometer in a small form factor package
US2015062563A1 Optical time domain reflectometer with high resolution and high sensitivity
WO2012158671A1 Compact optical package made with planar structures
WO2012006176A1 Low profile fiber-to-module interface with relaxed alignment tolerances
WO2011123687A1 Integrated optical time domain reflectometer
WO2011011332A1 Patterned backside optical coating on transparent substrate
US2010067853A1 Attachable components for providing an optical interconnect between/through printed wiring boards