TYSUN INC has a total of 11 patent applications. Its first patent ever was published in 2007. It filed its patents most often in Taiwan and Japan. Its main competitors in its focus markets electrical machinery and energy, semiconductors and audio-visual technology are ALBEO TECHNOLOGIES INC, AUGUX CO LTD and HU WUN SONG.
# | Industry | |
---|---|---|
#1 | Electrical machinery and energy | |
#2 | Semiconductors | |
#3 | Audio-visual technology | |
#4 | Machines |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Semiconductor light sources | |
#3 | Casings and printed circuits | |
#4 | Special light sources | |
#5 | Lighting device details | |
#6 | Unspecified technologies |
# | Name | Total Patents |
---|---|---|
#1 | Lin Shun-Tian | 10 |
#2 | Huang Jyun-Wei | 8 |
#3 | Hsu Tzu-Hao | 2 |
#4 | Wu Sin-Sian | 2 |
#5 | Chien Wen-Hsiang | 2 |
#6 | Chuang Chao-Chun | 1 |
#7 | Yang Yue-Lin | 1 |
#8 | Lin Wen-Chin | 1 |
#9 | Wu Sin Sian | 1 |
#10 | Lin Shun Tian | 1 |
Publication | Filing date | Title |
---|---|---|
TW201011172A | Push pin | |
TW200917517A | LED optical module and fabricating method thereof | |
TW200847468A | Heat-dissipating substrates for light-emitting diodes | |
TW200847469A | Substrates of curved surface for light emitting diodes | |
TW200847467A | Light emitting diode lamp | |
TW200843889A | Process for making brazed diamond tools | |
TW200845877A | Heat-dissipating substrates of composite structure | |
TW200833225A | Thermal module of composite structure | |
TW200833210A | Process for making substrates for chips of high power |