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TYNTEK CORP

Overview
  • Total Patents
    66
  • GoodIP Patent Rank
    57,406
  • Filing trend
    ⇩ 18.0%
About

TYNTEK CORP has a total of 66 patent applications. It decreased the IP activity by 18.0%. Its first patent ever was published in 2003. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets semiconductors, electrical machinery and energy and surface technology and coating are FORMOSA EPITAXY INC, ZHANJING SCIENCE & TECH (SHENZHEN) CO LTD and SHEN YU-NUNG.

Patent filings in countries

World map showing TYNTEK CORPs patent filings in countries

Patent filings per year

Chart showing TYNTEK CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Gong Zheng 8
#2 Tseng Shih-Che 6
#3 Chen Yi-Hong 6
#4 Song Jia-Bin 5
#5 Liang Yong-Long 5
#6 Huang Guo-Rui 4
#7 Hsu Mao-Sung 4
#8 Chen Yihong 4
#9 Chou Wen-Long 4
#10 Lin Guan-Chen 3

Latest patents

Publication Filing date Title
TWI710733B LED lighting module
TW202029363A Structure for packaging and method for manufacturing the same
TW202015260A Laser packaging structure having a light sensing element for detecting reflected light to determine whether a diffuser sheet causes damage or not
TW202013762A Laser package structure wherein the light value of the light-emitting element is monitored by the photosensor, and the light intensity of the light-emitting element is controlled according to the light value
CN110880540A Photodiode and method for manufacturing the same
TW202010141A Photodiode and its manufacturing method which can increase the responsivity of the light received from the side
US2019242839A1 Gas sensor
TW201934993A Gas sensor including a monocrystal gallium oxide series film which grows as the oxide epitaxy sensing layer by organometallic chemical vapor deposition
CN109671810A Light emitting diode and its manufacturing method without substrate
JP2019071323A Substrate-free light emitting diode and manufacturing method thereof
TW201916400A Substrate-free light-emitting diode and manufacturing method thereof capable of reducing the thickness of the light-emitting diode
TW201913979A Solar-Blind Detecting Device With Wide Bandgap Oxide
TW201913742A Method For Manufacturing Wide Bandgap Oxide Film
KR101827567B1 Light emitting device and method for manufacturing the same
JP2018137303A Light-emitting element and method for manufacturing the same
CN108461608A The manufacturing method of light-emitting component and light-emitting component
TW201830737A Light-emitting device and manufacturing method of light-emitting device using a conductor line to connect two ohmic contact layers so that a package process required by wire bonding can be eliminated to thus reduce the size of the light-emitting device
TW201828486A Photoelectric diode and manufacturing method of photoelectric diode form at least a photosensitive structure through a procedure of performing etching on the light receiving region (P-type or N-type semiconductor layer)
CN107346798A The light emitting diode of metal bond and form metallic bond and bind up one's hair the method for optical diode
TW201739068A Metal bonded light emitting diode and method for forming metal bonded light emitting diode including a substrate, a first bonding metal layer, a second bonding metal layer, a conductive oxide layer and an epitaxial layer