Learn more

TOYO SEIKAN GROUP HOLDINGS LTD

Overview
  • Total Patents
    1,755
  • GoodIP Patent Rank
    1,118
  • Filing trend
    ⇩ 25.0%
About

TOYO SEIKAN GROUP HOLDINGS LTD has a total of 1,755 patent applications. It decreased the IP activity by 25.0%. Its first patent ever was published in 2004. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets machines, packaging and shipping and surface technology and coating are PRINTPACK ILLINOIS INC, AMCOR FLEXIBLES KREUZLINGEN and SHANGHAI TANGKE NEW PACKAGE MAT CO LTD.

Patent filings per year

Chart showing TOYO SEIKAN GROUP HOLDINGS LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Akutsu Yosuke 158
#2 Iwamoto Shinya 118
#3 Yoshikawa Seishi 107
#4 Tanaka Satoshi 96
#5 Yamada Toshiki 89
#6 Iwasaki Tsutomu 84
#7 Katayama Tsutaki 83
#8 Suenaga Ryo 80
#9 Akuzawa Norio 78
#10 Ohashi Kazuaki 76

Latest patents

Publication Filing date Title
WO2021079861A1 Adherent cell culture substrate, culture vessel, peeling method of cell, and method for manufacturing adherent cell culture substrate
WO2021059913A1 Propylene-based resin composition and heat-seal film
WO2021039692A1 Gas barrier film, and paint composition for forming gas barrier layer
JP2020174683A Hydroponic cultivation system
WO2020250737A1 Nanocellulose-containing gas barrier molding and method for manufacturing same
WO2020250738A1 Resin composition containing cellulose nanocrystals
WO2020235547A1 Ni-based self-fluxing alloy, glass production member using ni-based self-fluxing alloy, and mold and glass mass transport member each using glass production member
WO2020218152A1 Cellulose nanocrystal composite and production method therefor
JP2020169387A Metal copper fine particle powder and method for producing the same
JP2020169167A Antiviral agent comprising metal copper fine particle
WO2020204119A1 Metal copper fine particle-containing resin composition and method for producing same
WO2020204118A1 Fine particle powder of metallic copper and method for manufacturing same
WO2020203946A1 Solid poly(lactic acid) composition and production method therefor
WO2020196175A1 Nanocellulose dispersion liquid and method for producing same
WO2020175454A1 Moisture barrier laminate
WO2020158355A1 Seamless can body and method for producing seamless can body
WO2020116658A1 Fiber-reinforced polyimide resin molding precursor and method for producing same
JP2020031661A Hydroponic cultivation system
WO2020137298A1 Sealing material, method for manufacturing same, and all-solid-state secondary battery
WO2020100774A1 Coated metal plate and drawn-and-ironed can