TOYAMA MACHINERIES CO LTD has a total of 12 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2005. It filed its patents most often in Japan, China and EPO (European Patent Office). Its main competitors in its focus markets environmental technology and semiconductors are WU XIANTONG, XIAO YIJIAN and FU JIANFANG.
# | Country | Total Patents | |
---|---|---|---|
#1 | Japan | 8 | |
#2 | China | 1 | |
#3 | EPO (European Patent Office) | 1 | |
#4 | Republic of Korea | 1 | |
#5 | Taiwan | 1 |
# | Industry | |
---|---|---|
#1 | Environmental technology | |
#2 | Semiconductors |
# | Technology | |
---|---|---|
#1 | Reduction of greenhouse gas emissions | |
#2 | Semiconductor devices | |
#3 | Climate change mitigation in buildings |
# | Name | Total Patents |
---|---|---|
#1 | Sugino Akitoshi | 8 |
#2 | Toyama Toshio | 3 |
#3 | Toshio Toyama | 1 |
#4 | Mowatari Ken | 1 |
Publication | Filing date | Title |
---|---|---|
JP2018168999A | Spring clip used in fitting machine and fitting machine | |
JP2017095208A | Tape sticking device | |
JP2016216252A | Conductive tape sticking device | |
JP2015074903A | Building plate material and solar cell module fixing structure using building plate material | |
JP2015053305A | Foundation pile and frame for solar cell module using foundation pile | |
JP2014043380A | Glass molding apparatus | |
JP2014036177A | Welding device for lead | |
JP2011238874A | Deposition method for reed and device of the same |