Learn more

TKX CORP

Overview
  • Total Patents
    77
  • GoodIP Patent Rank
    43,312
  • Filing trend
    ⇩ 66.0%
About

TKX CORP has a total of 77 patent applications. It decreased the IP activity by 66.0%. Its first patent ever was published in 1998. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets machine tools, environmental technology and semiconductors are DD DIAMOND CORP, SAESOL DIAMOND IND CO LTD and JAPAN FINE STEEL CO LTD.

Patent filings in countries

World map showing TKX CORPs patent filings in countries

Patent filings per year

Chart showing TKX CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Ikeuchi Masahiko 27
#2 Kondo Takayuki 22
#3 Endo Tadashi 18
#4 Fukada Masaki 11
#5 Isurugi Yuya 7
#6 Tsuda Osamu 6
#7 Gueshi Tatsuro 6
#8 Kawasaki Katsuhiro 6
#9 Nakao Toshihiko 6
#10 Kawasaki Mitsukazu 5

Latest patents

Publication Filing date Title
JP2019051586A Wire rod for slice processing and manufacturing method thereof
JP2020025993A Wire saw
JP2019075531A Multi-wire saw device
JP2019089164A Ingot slice table manufacturing system
JP2019075469A Multi-wire saw device and wire for slicing used for the same
JP2019054655A Method of predicting fire-through properties in silicon wafer for solar cell panel and method of manufacturing silicon wafer for solar cell panel
WO2018026010A1 Method and tester for evaluating resin diamond wire saw
TW201819572A Resin bond wire saw and method for producing the same
SG11201804316UA Device for manufacturing coated wire
WO2017163599A1 Coating material application device and coating material application method
JP2018065205A Saw wire and slicing method
JP2018064030A Multiple wire saw device
WO2016171018A1 Method for producing fine silicon powder, and method for producing fine silicon nitride powder
JP2016210530A Wire take-up device
JP2014225633A Silicon wafer for solar batteries, and method for manufacturing the same
JP2015093808A Silicon raw material a for producing hydrogen gas, silicon raw material b for producing hydrogen gas, method of producing silicon raw material a for producing hydrogen gas, method of producing silicon raw material b for producing hydrogen gas, method and apparatus for producing hydrogen gas
JP2014133288A Resin bond wire saw
MY153895A Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw
JP2012101334A Cutting tool
JP2010201602A Fixed abrasive grain type wire saw, and manufacturing method therefor