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THERMAL CONDUCTIVE BONDING INC

Overview
  • Total Patents
    11
About

THERMAL CONDUCTIVE BONDING INC has a total of 11 patent applications. Its first patent ever was published in 2006. It filed its patents most often in Taiwan, WIPO (World Intellectual Property Organization) and Republic of Korea. Its main competitors in its focus markets surface technology and coating, electrical machinery and energy and machines are SUNTEK PREC CORP, ADVANCED DISPLAY PROVIDER ENGINEERING CO LTD and ENERGY SCIENCES INC.

Patent filings per year

Chart showing THERMAL CONDUCTIVE BONDING INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Simpson Wayne R 8
#2 Scatena Ryan A 8
#3 Stevenson Thomas R 5
#4 Guerrero Jaime F 3
#5 Wayne R Simpson 2
#6 Ryan A Scatena 2
#7 Thomas R Stevenson 2
#8 Stack Andrew P 1
#9 Jaime F Guerrero 1
#10 Simpson Joseph A 1

Latest patents

Publication Filing date Title
US2014021044A1 Elastomer Bonded Rotary Sputtering Target
US2014020845A1 Method For Debonding Items With Reactive Multilayer Foil
TW201303058A Elastomer bonded item and method for debonding
WO2007041425A2 Very long cylindrical sputtering target and method for manufacturing
KR20080017440A Large area elastomer bonded sputtering target and method for manufacturing