Learn more

TAMURA KAKEN CO LTD

Overview
  • Total Patents
    222
About

TAMURA KAKEN CO LTD has a total of 222 patent applications. Its first patent ever was published in 1974. It filed its patents most often in Japan, United States and Canada. Its main competitors in its focus markets audio-visual technology, machine tools and optics are TAMURA KAKEN CORP, HITACHI VIA MECHANICS LTD and FRYS METALS INC DBA ALPHA METALS INC.

Patent filings in countries

World map showing TAMURA KAKEN CO LTDs patent filings in countries
# Country Total Patents
#1 Japan 208
#2 United States 10
#3 Canada 1
#4 China 1
#5 Germany 1
#6 United Kingdom 1

Patent filings per year

Chart showing TAMURA KAKEN CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Ono Takao 92
#2 Yanagawa Makoto 52
#3 Kiyota Tatsuya 22
#4 Takahashi Yoshiyuki 20
#5 Yamamoto Hiroshi 20
#6 Miura Ichiro 19
#7 Okuya Takeshi 15
#8 Akaike Shinichi 12
#9 Iwabuchi Mitsuru 12
#10 Mitsufuji Shinji 12

Latest patents

Publication Filing date Title
JP2010079261A Photosensitive resin composition, solder resist composition for printed wiring board, and printed wiring board
JP2010111912A Method of removing lead, reclaimed metal and reclaimed product
JP2010094719A Solder paste for soldering to circuit board, and circuit board
JP2010083844A New imidazole compound, surface-treating agent, printed circuit board, and method for producing the same
JP2008257113A Developing solution for solder resist and method for developing printed wiring board
JP2008211036A Photosensitive resin composition, solder resist composition for printed wiring board, and printed wiring board
JP2008193036A Semiconductor package substrate for mounting conductive balls and the like, method of manufacturing the same, and conductive jointing material for the semiconductor package substrate
JP2008037957A Thermosetting resin composition, b-stage resin film and multilayer build-up substrate
JP2007224242A Thermosetting resin composition, resin film in b stage and multilayer build-up base plate
JP2006289493A Sn-zn based solder, lead-free solder, its solder work, solder paste, and electronic component-soldering substrate
JP2006199937A Conductive adhesive and conductive part and electronic part module using the same
JP2007136491A Solder paste composition
JP2007133070A Resist ink, printed wiring board and method for producing resist ink
JP2007099956A Thermosetting resin composition, resin film and structure
JP2007059451A Printed circuit board, and method of treating surface of metal of the printed circuit board
JP2006328214A Thermosetting resin composition, resin film, and film-attached product
JP2006259150A Photosensitive resin composition and printed wiring board
JP2006220828A Method of exposing resist film
JP2005281673A Thermosetting resin composition, resin film and product
JP2005248164A Thermosetting resin composition and film-having product