TAKAHASHI SEIKI has a total of 16 patent applications. Its first patent ever was published in 1983. It filed its patents most often in Japan and United States. Its main competitors in its focus markets computer technology, optics and machines are TOUCH CO LTD A, SHIH PO-SHENG and TIANMA MICROELECTRONICS CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | Japan | 10 | |
#2 | United States | 6 |
# | Industry | |
---|---|---|
#1 | Computer technology | |
#2 | Optics | |
#3 | Machines | |
#4 | Audio-visual technology | |
#5 | Basic communication technologies | |
#6 | Environmental technology |
# | Technology | |
---|---|---|
#1 | Electric digital data processing | |
#2 | Shaping of plastics | |
#3 | Nonlinear optics | |
#4 | Television | |
#5 | Climate change adaptation technologies | |
#6 | Pulse technique |
# | Name | Total Patents |
---|---|---|
#1 | Takahashi Seiki | 8 |
#2 | Takahashi Shigehisa | 5 |
#3 | Kanie Noboru | 4 |
#4 | You Bong-Hyun | 4 |
#5 | Kim Sang-Soo | 3 |
#6 | Lee Byoung-Jun | 3 |
#7 | Choi Hee-Jin | 2 |
#8 | Takahashi Kiyoshi | 2 |
#9 | Takahashi Hisataka | 1 |
#10 | Koh Jai-Hyun | 1 |
Publication | Filing date | Title |
---|---|---|
JP2011172554A | Carbon heater for growing plants in vinyl film greenhouse | |
JP2011056774A | Laminate molding apparatus | |
JP2009279850A | Wall thickness variable mechanism of injection molding die and method of manufacturing expanded product using this mechanism | |
JP2004199008A | Commodity advertising tool | |
JP2000351150A | Parison molding apparatus | |
JPH0524128A | Composite molding device of synthetic resin | |
JPH0262213A | Method for molding plastic | |
JPS63188033A | Molding method for synthetic resin product | |
JPS63178014A | Insert molder | |
JPS60122126A | Injection molding machine |