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TAJIMA ROOFING INC

Overview
  • Total Patents
    71
  • GoodIP Patent Rank
    57,077
  • Filing trend
    ⇧ 14.0%
About

TAJIMA ROOFING INC has a total of 71 patent applications. It increased the IP activity by 14.0%. Its first patent ever was published in 2007. It filed its patents most often in Japan and United States. Its main competitors in its focus markets environmental technology, civil engineering and macromolecular chemistry and polymers are TAKEI JIROU, HIGASHI NIPPON HOUSE KK and WANG KEQUAN.

Patent filings in countries

World map showing TAJIMA ROOFING INCs patent filings in countries
# Country Total Patents
#1 Japan 70
#2 United States 1

Patent filings per year

Chart showing TAJIMA ROOFING INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tajima Kunio 26
#2 Goto Yoshiaki 13
#3 Kojima Toru 12
#4 Fukuda Sugio 12
#5 Kinoshita Takefumi 10
#6 Ito Takashi 10
#7 Sekine Haruyuki 9
#8 Kamei Masahiro 8
#9 Abe Kazuhiro 7
#10 Suzuki Yoshiji 6

Latest patents

Publication Filing date Title
JP2021004547A Repair method of existing slate roof
US2021115679A1 Vinyl composition tile and method for producing same
JP2021001539A Seal joint processing method of seam
JP2020200619A Underlayer material
JP2020147694A Resin composition for floor material and floor material
JP2020114965A Roof finishing material and roof repairing method
JP2020090879A Porous sheet and manufacturing method thereof
JP2020016117A Floor tile
JP2019218084A Packing box
JP2019218700A Nonslip floor material
JP2019214165A Tile and production method of tile
JP2019214822A Drain fitting device
JP2019199755A Drain fitting device
JP2019190133A Floor material and method of manufacturing floor material
JP2019050741A Greening parting member, installation system of greening parting member, and installation method of greening parting member
JP2019019833A Fixture
JP2019007142A Floor tile having pattern, and manufacturing method thereof
JP2018197434A Drain material
JP2018115530A Conductive primer and waterproof structure using the same
JP2018115302A Conductive adhesive composition for waterproof construction and waterproof structure