TAIWAN TAIYO INK CO LTD has a total of 29 patent applications. Its first patent ever was published in 2006. It filed its patents most often in Taiwan, Japan and China. Its main competitors in its focus markets macromolecular chemistry and polymers, optics and machines are SHENZHEN AIMSEA IND CO LTD, JIANGSU LISIDE NEW MAT CO LTD and CHUZHOU YOUSHENG HIGH POLYMER MAT CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | Taiwan | 8 | |
#2 | Japan | 7 | |
#3 | China | 6 | |
#4 | Hong Kong | 6 | |
#5 | Republic of Korea | 2 |
# | Industry | |
---|---|---|
#1 | Macromolecular chemistry and polymers | |
#2 | Optics | |
#3 | Machines | |
#4 | Basic materials chemistry | |
#5 | Audio-visual technology |
# | Technology | |
---|---|---|
#1 | Macromolecular compounds compositions | |
#2 | Compounding ingredients | |
#3 | Compounding processes | |
#4 | Optical systems | |
#5 | Special macromolecular compounds | |
#6 | Coating compositions | |
#7 | Advertising |
# | Name | Total Patents |
---|---|---|
#1 | Huang Fu Kang | 22 |
#2 | Liu Chuan Hsiung | 22 |
#3 | Sugita Masashi | 8 |
#4 | Huang Chih Hsuan | 6 |
#5 | Yeh Ching Liang | 6 |
#6 | Chu Chen Yu Han | 5 |
#7 | Masashi Sugita | 4 |
#8 | Yang Chun Hsiang | 4 |
#9 | Sugita Shiyouji | 4 |
#10 | Kang Huang Fu | 4 |
Publication | Filing date | Title |
---|---|---|
TWI609382B | Dielectric material composition, insulated film and circuit board containing the same | |
JP2016135827A | Thermosetting resin composition, cured product thereof, and member for display using the same | |
JP2016135826A | Thermosetting resin composition, cured product thereof, and member for display using the same | |
JP2015078290A | Thermosetting resin composition, cured product thereof and member for display using the same | |
JP2015078293A | White thermosetting resin composition, cured product thereof and member for display using the same | |
JP2015078291A | Thermosetting resin composition, cured product thereof, and display member using the same | |
JP2015078292A | White thermosetting resin composition, cured product thereof and member for display using the same | |
TW200736330A | Encapsulating materials for solid state devices |