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TAI SAW TECHNOLOGY CO LTD

Overview
  • Total Patents
    24
  • GoodIP Patent Rank
    223,488
About

TAI SAW TECHNOLOGY CO LTD has a total of 24 patent applications. Its first patent ever was published in 2002. It filed its patents most often in Taiwan, United States and Germany. Its main competitors in its focus markets semiconductors, machines and basic communication technologies are ADKISSON JAMES W, NEWPORT FAB LLC DBA JAZZ SEMICONDUCTOR and KYOCERA KINSEKI CORP.

Patent filings in countries

World map showing TAI SAW TECHNOLOGY CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 14
#2 United States 8
#3 Germany 1
#4 Japan 1

Patent filings per year

Chart showing TAI SAW TECHNOLOGY CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Huang Yu-Tung 7
#2 Lin Ken-Huang 6
#3 Huang Yu Tung 4
#4 Lin Ken Huang 4
#5 Huang Chen-Tung 4
#6 Chiu Shih-Cheng 3
#7 Lin Kuan-Yu 3
#8 Chen Chi Yun 3
#9 Chen Chi-Yun 3
#10 You Hsang-Hsing 2

Latest patents

Publication Filing date Title
TW202024635A Quasi-volumetric sensing system and method
TW201526124A Conducting packaging structure and manufacturing method thereof
TW201345177A Multiple-input multiple-output antenna
TW201338265A Quasi-fractal antenna
TW201228101A Modified antenna
TW200703894A Back-side arc edposition and duel development for high frequency surface acoustic wave device fabrication
US2006255682A1 Surface acoustic wave device with electro-static discharge protection
TWI245383B Integrated and monolithic packing structure of surface acoustic wave device
TW200605499A Surface acoustic wave device with electro-static discharge protection
TWI228285B Package structure with a retarding structure and method of making same
TWI231976B Package assembly for electronic device and method of making same
US7064452B2 Package structure with a retarding structure and method of making same
US7239023B2 Package assembly for electronic device
TWI220691B Three poles monolithic quartz crystal filter measurement circuit and corresponding measuring method
US6924083B2 Mask layout and exposing method for reducing diffraction effects by using a single mask in the process of semiconductor production
TWI290733B The mask layout and exposing method for reducing diffraction effects by using a single mask in the process of semiconductor production
TW557591B Surface acoustic wave element using the structure and method of connecting the conductive layer back to back
TW575950B Packaging structure and process thereof