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SYNOVA S A

Overview
  • Total Patents
    47
  • GoodIP Patent Rank
    39,543
  • Filing trend
    ⇧ 150.0%
About

SYNOVA S A has a total of 47 patent applications. It increased the IP activity by 150.0%. Its first patent ever was published in 1994. It filed its patents most often in EPO (European Patent Office), WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets machine tools, machines and optics are SYNOVA SA, KUNSHAN HPMATERIALS TECHNOLOGY CO LTD and MAULE CLEMENTE.

Patent filings per year

Chart showing SYNOVA S As patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Richerzhagen Bernold 39
#2 Diehl Helgi 28
#3 Hippert David 12
#4 Anderegg Ludovic 7
#5 Diboine Jérémie 7
#6 Gheorghe Adrian 6
#7 Epple Maximilian 6
#8 Laporte Grégoire 6
#9 Kim Hyuk 5
#10 Bernold Richerzhagen 5

Latest patents

Publication Filing date Title
EP3685954A1 Method and apparatus for cutting a workpiece with a complex fluid-jet-guided laser beam
EP3533557A1 Apparatus for machining a workpiece with a laser beam coupled into a fluid jet, with automatic laser-nozzle alignment ; method of aligning such a beam
EP3513898A1 Apparatus for automatic jet angle adjustment
EP3492210A1 Apparatus for 3d shaping of a workpiece by a liquid jet guided laser beam
EP3486027A1 Apparatus for measuring a fluid jet guiding a laser beam
EP3470165A1 Apparatus for machining a workpiece with a liquid jet guided laser beam and the assembly thereof
EP3466597A1 Apparatus for machining a workpiece with a laser beam
EP3124165A1 Process of treating a workpiece using a liquid jet guided laser beam
EP2960006A1 Method and apparatus for determining a position of a liquid jet through the modification of an orientation
EP2208568A1 Apparatus and method for processing material by means of laser
EP2189236A1 Method and apparatus for improving reliability of a machining process
WO9956907A1 Material shaping device with a laser beam which is injected into a stream of liquid
DE4418845C1 Method and device for material processing using a laser beam