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SWANCOR IND CO LTD

Overview
  • Total Patents
    49
  • GoodIP Patent Rank
    64,895
  • Filing trend
    0.0%
About

SWANCOR IND CO LTD has a total of 49 patent applications. It increased the IP activity by 0.0%. Its first patent ever was published in 1998. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets machines, macromolecular chemistry and polymers and surface technology and coating are CYTEC IND INC, SHANGHAI XINAN CAR DEADENING FELT CO LTD and SHANGHAI XIN'AN CAR DEADENING FELT CO LTD.

Patent filings in countries

World map showing SWANCOR IND CO LTDs patent filings in countries

Patent filings per year

Chart showing SWANCOR IND CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tseng Yu-Tsan 20
#2 Chien Chen-Han 11
#3 Tan Kok-Sheng 9
#4 Tsai Jau-Yang 6
#5 Yu Shr-Wen 5
#6 Tsai Jau-Yan 4
#7 Yur Shih-Wen 3
#8 Shih Sheng-Wei 3
#9 Yu Shi-Wen 3
#10 Wu Li-Chu 3

Latest patents

Publication Filing date Title
TW201924911A Press forming method and press forming apparatus for continuous fiber composite sheet
TW201925281A Method of manufacturing multi-layer thermoplastic composite sheet with continuous-discontinuous fibers
TW201922875A Laminated body and formred body
CN108215133A The making apparatus and production method of plastic article
TWI583715B Epoxy oligomer
US2017247518A1 Thermoplastic prepreg
US2017218113A1 Thermoplastic epoxy matrix formulation, prepreg, composite and method for manufacturing the same
US2017137587A1 Precursor blend for preparing a thermoplastic polymer for a fiber-reinforced composite material and method for preparing the fiber-reinforced composite material
CN106700032A Branched thermoplastic composite and preparation method thereof
CN106117514A Difunctionality base epoxy and monofunctional primary amine and/or difunctionality base secondary amine hardener mixture are as the purposes of prepreg
TW201634543A Use of a mixture of difunctional epoxy with monofunctional primary amine compound and/or difunctional secondary amine curing agent; composites comprising the mixture and the manufacture method thereof
CN103627163A LED (Light Emitting Diode) packaging polyurethane resin composition
TW201508012A A resin composition for use in light emitting diode packaging
TW201343764A A vinyl ester resin composition, and a vinyl ester resin
TW201200571A Encapsulant composition
TW201204604A Glue joining article and its glue-taking method
CN103013041A Epoxy resin composition
TW201122013A Epoxy resin composition
TW201043642A A method of increasing the shelf life of a vinyl ester resin or an unsaturated polyester resin
US2009048422A1 Resin composition for composite material parts