| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 4 | |
| #2 | United States | 3 | |
| #3 | EPO (European Patent Office) | 2 | |
| #4 | Republic of Korea | 1 | |
| #5 | Malaysia | 1 | |
| #6 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Materials and metallurgy |
| # | Technology | |
|---|---|---|
| #1 | Grinding or polishing devices | |
| #2 | Making metal sheets | |
| #3 | Metal tempering | |
| #4 | Alloys | |
| #5 | Rolling metal |
| # | Name | Total Patents |
|---|---|---|
| #1 | Suwabe Hitoshi | 12 |
| #2 | Ono Toshihide | 2 |
| #3 | Omori Hiroshi | 1 |
| #4 | Ogami Hiroyuki | 1 |
| #5 | Ishikawa Kenichi | 1 |
| #6 | Konishi Tomoyuki | 1 |
| Publication | Filing date | Title |
|---|---|---|
| JP2009023066A | Saw wire and cutting method by wire saw using saw wire | |
| JP2003022990A | Polishing device | |
| TWI261009B | Polishing machine | |
| JP2003303795A | Polishing equipment | |
| JP2001326202A | Method and device for polishing wafer |