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SUN A KAKEN CO LTD

Overview
  • Total Patents
    135
  • GoodIP Patent Rank
    32,402
  • Filing trend
    ⇧ 100.0%
About

SUN A KAKEN CO LTD has a total of 135 patent applications. It increased the IP activity by 100.0%. Its first patent ever was published in 1995. It filed its patents most often in Japan, United States and Republic of Korea. Its main competitors in its focus markets packaging and shipping, machines and textiles and paper are NAZARI JOSEPH, CARPENTER HIATT SALES COMPANY and PAPIERS A PAVIOT.

Patent filings per year

Chart showing SUN A KAKEN CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hayama Tomohito 31
#2 Tanaka Mikio 26
#3 Tonogaki Tomoya 16
#4 Hashimoto Kenji 13
#5 Uratani Daisuke 13
#6 Shibazaki Tsuyoshi 12
#7 Mochizuki Masaaki 10
#8 Yamamoto Akihiro 10
#9 Koike Toshihiro 10
#10 Izawa Masatake 10

Latest patents

Publication Filing date Title
JP2021006469A Air cushioning material
JP2021004050A Refill pouch with spout
JP2020111337A Package for heat treatment
JP2020055582A Heat treatment packaging bag, manufacturing method of heat treatment packaging bag and food for microwave oven
JP2020029299A Packaging bag for heat processing and method of manufacturing packaging bag for heat processing
JP2020006379A Protection film for laser process
JP2020001819A Heating treatment packaging bag, manufacturing method of heating treatment packaging bag, and food product for microwave oven
JP2019178273A Surface protective film
JP2019177905A Package for heat treatment
JP2019177753A Sound absorber for pneumatic tire, and pneumatic tire
JP2019147575A Cushioning material for columnar product
JP2019034777A Air cushioning package and alteration prevention structure for package
JP2019034776A Package cushioning
JP2018122580A Surface protective film
JP2018070222A Heat treatment package
JP2018070223A Heat treatment package
JP2018070224A Heat treatment package
JP2018047941A Package for heat treatment
JP2018034808A Heat treatment pack and heat treatment kit
JP2018016374A Buffer packaging material, buffer packaging material assembly, and packaging method using buffer packaging material