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SUMITOMO ELECTRIC PRINTED CIRCUIT INC

Overview
  • Total Patents
    67
  • GoodIP Patent Rank
    37,435
  • Filing trend
    ⇩ 71.0%
About

SUMITOMO ELECTRIC PRINTED CIRCUIT INC has a total of 67 patent applications. It decreased the IP activity by 71.0%. Its first patent ever was published in 2010. It filed its patents most often in Japan. Its main competitors in its focus markets audio-visual technology, electrical machinery and energy and macromolecular chemistry and polymers are KOOJIN KK, HAROLD VEZEY STRONG and WERK FUER SIGNAL U SICHERUNGST.

Patent filings in countries

World map showing SUMITOMO ELECTRIC PRINTED CIRCUIT INCs patent filings in countries
# Country Total Patents
#1 Japan 67

Patent filings per year

Chart showing SUMITOMO ELECTRIC PRINTED CIRCUIT INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Uchida Yoshifumi 16
#2 Miura Kosuke 7
#3 Kitani Satoshi 7
#4 Ueda Hiroshi 7
#5 Kochi Masahiko 6
#6 Morizane Katsuya 6
#7 Tsumagari Takayuki 6
#8 Saito Hirohisa 5
#9 Morita Seiji 5
#10 Nagara Shunji 5

Latest patents

Publication Filing date Title
JP2020145338A Wiring board
JP2020145339A Wiring board
JP2019212713A Flexible printed wiring board
JP2019192786A Flexible printed wiring board
JP2019114722A Printed wiring board and method of manufacturing printed wiring board
JP2018161002A Non-contact charging system, power feeder, and power receiver
JP2018160606A Transformer
JP2018160625A Flat surface coil substrate
JP2018160599A Planar coil element
JP2018160605A Non-contact power feeding mechanism
JP2018110193A Original board for printed wiring board and printed wiring board
JP2018107284A Electrical connection structure and electrical connection method
JP2018067694A Printed wiring board array and method of manufacturing the same
JP2017011314A Printed wiring board and manufacturing method therefor
JP2018010911A Thermally conductive flexible printed wiring board and method for manufacturing thermally conductive flexible printed wiring board
JP2018006480A Planar coil element and wireless power supply device
JP2017216407A Printed-wiring board and method for manufacturing the same
JP2017204525A Flexible printed wiring board and electronic parts
JP2017199802A Flexible Printed Wiring Board
JP2017115221A Printed wiring board plating device and printed wiring board manufacturing method