| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 4 | |
| #2 | Germany | 3 | |
| #3 | Canada | 2 | |
| #4 | Republic of Korea | 2 | |
| #5 | China | 1 | |
| #6 | Mexico | 1 | |
| #7 | South Africa | 1 |
| # | Industry | |
|---|---|---|
| #1 | Computer technology | |
| #2 | Consumer goods | |
| #3 | Semiconductors | |
| #4 | Machines | |
| #5 | Surface technology and coating | |
| #6 | Telecommunications |
| # | Technology | |
|---|---|---|
| #1 | Data recognition and presentation | |
| #2 | Books | |
| #3 | Semiconductor devices | |
| #4 | Layered products | |
| #5 | Shaping of plastics | |
| #6 | Antennas | |
| #7 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Rietzler Manfred | 9 |
| #2 | Fannasch Lothar | 3 |
| #3 | Wendisch Karl-Heinz | 2 |
| #4 | Castano Philippe | 1 |
| #5 | Manfred Reitzler | 1 |
| #6 | Manfred Rietzler | 1 |
| #7 | Wendisch Karl Heinz | 1 |
| Publication | Filing date | Title |
|---|---|---|
| DE102006030819A1 | Chip card and method for producing a chip card | |
| DE102005044216A1 | Chip module and method for producing a chip module | |
| KR20050020615A | Method for producing a security layered construction and security layered construction and indentification documents containing such a construction | |
| DE102004004469A1 | Production of a security layered structure for identification documents |