| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Hong Kong | 4 | |
| #2 | Australia | 1 | |
| #3 | Canada | 1 | |
| #4 | China | 1 | |
| #5 | EPO (European Patent Office) | 1 | |
| #6 | Japan | 1 | |
| #7 | United States | 1 | |
| #8 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Electrical machinery and energy | |
| #2 | Semiconductors | |
| #3 | Audio-visual technology |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor light sources | |
| #2 | Lighting device details | |
| #3 | Semiconductor devices | |
| #4 | Casings and printed circuits | |
| #5 | Special light sources |
| # | Name | Total Patents |
|---|---|---|
| #1 | Yeung Andrew | 5 |
| #2 | Wan Shan Mei | 4 |
| #3 | Yeung Chi Keung | 4 |
| #4 | Yang Zhiqiang | 1 |
| #5 | Wen Shanmei | 1 |
| #6 | Andrew Yeung | 1 |
| Publication | Filing date | Title |
|---|---|---|
| CA2964421A1 | Substrate used for led encapsulation, three-dimensional led encapsulation, bulb comprising three-dimensional led encapsulation and manufacturing method therefor | |
| HK1204216A2 | Light bulb with three-dimensional led packages led | |
| CN104613346A | Manufacturing method for bulb with three-dimensional LED package |