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SILICON MICROSTRUCTURES INC

Overview
  • Total Patents
    60
  • GoodIP Patent Rank
    34,984
  • Filing trend
    ⇩ 50.0%
About

SILICON MICROSTRUCTURES INC has a total of 60 patent applications. It decreased the IP activity by 50.0%. Its first patent ever was published in 1998. It filed its patents most often in United States, China and EPO (European Patent Office). Its main competitors in its focus markets measurement, medical technology and micro-structure and nano-technology are NT INT INC, WUXI KAIFENG PRESSURE GAUGES CO LTD and NAGANO KEIKI CO LTD.

Patent filings per year

Chart showing SILICON MICROSTRUCTURES INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Gaynor Justin 19
#2 Abed Omar 19
#3 Doering Holger 18
#4 Terry Stephen C 11
#5 Alfaro Fernando 11
#6 Van Sprakelaar Gertjan 8
#7 Allen Henry V 6
#8 Wagner Chris 6
#9 August Richard J 4
#10 Doelle Michael B 4

Latest patents

Publication Filing date Title
US2020282189A1 Sensor device and methods of operation for a catheter based treatment of myocardial microvascular obstruction
US2020284632A1 Flow sensor
US2020284677A1 Leadless pressure sensor
US2020284668A1 Pressure sensor die attach
US2020375540A1 Voltage nulling pressure sensor preamp
US2020284675A1 3d contact force sensing
US2019078914A1 Pressure sensor cap having flow path with dimension variation
CN109997022A Hood for catheter sensor
US2018099120A1 Light shields for catheter sensors
US2017131167A1 Manufacturing catheter sensors
US2017089788A1 Manufacturing catheter sensors
US2016178467A1 Pressure sensor having cap-defined membrane
US2016033349A1 Pressure sensor having cap-defined membrane
US2015316436A1 Vertical membranes for pressure sensing applications
US2015198496A1 Pressure testing with controlled applied fluid
US2015143926A1 Area-efficient pressure sensing device
US2014260650A1 Silicon plate in plastic package
US2014131821A1 Pressure sensing device having contacts opposite a membrane
EP2675749A1 Compensation of stress effects on pressure sensor components
US2013008255A1 Temperature extraction from a pressure sensor