| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 3 | |
| #2 | United States | 3 | |
| #3 | WIPO (World Intellectual Property Organization) | 3 | |
| #4 | EPO (European Patent Office) | 2 | |
| #5 | Republic of Korea | 2 | |
| #6 | Brazil | 1 | |
| #7 | India | 1 | |
| #8 | Russian Federation | 1 |
| # | Industry | |
|---|---|---|
| #1 | Materials and metallurgy | |
| #2 | Electrical machinery and energy | |
| #3 | Surface technology and coating | |
| #4 | Machine tools |
| # | Technology | |
|---|---|---|
| #1 | Alloys | |
| #2 | Casting metal | |
| #3 | Coating metallic material | |
| #4 | Non-metallic elements | |
| #5 | Cables and insulators | |
| #6 | Metal production and refining | |
| #7 | Soldering, welding and flame cutting |
| # | Name | Total Patents |
|---|---|---|
| #1 | Ijichi Yoshihito | 14 |
| #2 | Ohshima Kenichi | 13 |
| #3 | Kenichi Ohshima | 2 |
| #4 | Yoshihito Ijichi | 2 |
| #5 | Oshima Kenichi | 1 |
| Publication | Filing date | Title |
|---|---|---|
| EP3192883A1 | Ai alloy containing cu and c and its manufacturing method | |
| KR20130039285A | Low-melting lead-free solder and its producing method | |
| WO2009075314A1 | Solder alloy and process for producing the same |