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SHINETSU ENG CO LTD

Overview
  • Total Patents
    232
  • GoodIP Patent Rank
    169,360
About

SHINETSU ENG CO LTD has a total of 232 patent applications. Its first patent ever was published in 1978. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets optics, semiconductors and surface technology and coating are FUTURE VISION INC, HAN DONG HEE and IMAGE QUEST TECHNOLOGIES INC.

Patent filings per year

Chart showing SHINETSU ENG CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yokota Michiya 60
#2 Ohtani Yoshikazu 57
#3 Ishizaka Ichiro 30
#4 Katagiri Kiyoo 27
#5 Otani Yoshikazu 20
#6 Takefushi Noriyuki 15
#7 Uchiyama Kazue 14
#8 Manabe Shigenori 12
#9 Mori Kanji 12
#10 Sakashita Mitsukuni 11

Latest patents

Publication Filing date Title
JP2016024416A Light orientation irradiation device and light orientation irradiation method
JP2015199218A Workpiece attachment device
JP2015153837A Workpiece chuck device, workpiece adhesion machine and workpiece adhesion method
WO2015083257A1 Method for manufacturing bonded device
WO2015040664A1 Photo-alignment irradiation device and method for adjusting aperture of photo-alignment irradiation device
JP2015055853A Device and method for manufacturing laminated device
JP2015036739A Bonding device manufacturing device and bonding device manufacturing method
JP2015015365A Adhesive chuck device
WO2014207867A1 Bonded device manufacturing method
JP2014220436A Sticking and separating method and separating device
WO2014109018A1 Workpiece adhesive chuck device and workpiece attachment machine
CN104919189A Actuator and adhesive chuck device
JP2014118537A Method for laminating work-piece and apparatus for laminating work-piece
JP2014039913A Fluid coating device
WO2013164881A1 Manufacturing method for display device and manufacturing apparatus therefor
CN103620487A Photo-orienting illumination device
JP2013120352A Method for manufacturing laminated device
CN103959453A Wafer transport apparatus and wafer assembly line
JP2012182254A Workpiece adhesive chuck device and workpiece adhering machine
WO2012117509A1 Thin plate-shaped workpiece adhesion and retention method, thin plate-shaped workpiece adhesion and retention device, and manufacturing system