| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 7 | |
| #2 | China | 3 | |
| #3 | EPO (European Patent Office) | 3 | |
| #4 | Taiwan | 3 |
| # | Industry | |
|---|---|---|
| #1 | Mechanical elements | |
| #2 | Materials and metallurgy | |
| #3 | Semiconductors | |
| #4 | Thermal processes |
| # | Technology | |
|---|---|---|
| #1 | Shafts | |
| #2 | Alloys | |
| #3 | Working metallic powder | |
| #4 | Semiconductor devices | |
| #5 | Heat-exchanger without contact | |
| #6 | Heat-exchange device details |
| # | Name | Total Patents |
|---|---|---|
| #1 | Lai Wen-Chen | 10 |
| #2 | Lai Wen Cheng | 2 |
| #3 | Lai Wen-Cheng | 2 |
| #4 | Huang Lung-Wei | 2 |
| Publication | Filing date | Title |
|---|---|---|
| US2018128310A1 | Ball bearing assembly | |
| TW201802365A | Double-layer sliding bearing | |
| TW201719041A | Ball bearing assembly | |
| TW201716699A | Bush assembly | |
| US2006039111A1 | [high-performance two-phase flow evaporator for heat dissipation] | |
| US2006016578A1 | [high-performance two-phase flow evaporator] |