| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 24 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Optics | |
| #3 | Surface technology and coating | |
| #4 | Audio-visual technology | |
| #5 | Chemical engineering | |
| #6 | Packaging and shipping | |
| #7 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Nonlinear optics | |
| #3 | Casings and printed circuits | |
| #4 | Cleaning | |
| #5 | Devices for applying fluent materials | |
| #6 | Transport or storage devices | |
| #7 | Optical systems | |
| #8 | Electrolytic processes | |
| #9 | Spraying devices | |
| #10 | Layered products |
| # | Name | Total Patents |
|---|---|---|
| #1 | Tsutomu Makino | 3 |
| #2 | Nori Isoaki | 3 |
| #3 | Masanori Hashimoto | 2 |
| #4 | Naoya Hayamizu | 2 |
| #5 | Nishibe Sachinobu | 2 |
| #6 | Nobuo Kobayashi | 2 |
| #7 | Masaaki Kato | 2 |
| #8 | Wakakage Takahiko | 2 |
| #9 | Sachinobu Nishibe | 2 |
| #10 | Yukihiro Shibata | 2 |
| Publication | Filing date | Title |
|---|---|---|
| CN101584032A | Equipment and method for mounting electronic component | |
| CN101253613A | The pick device of semiconductor chip and pick-up method |