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SHENZHEN INSTITUTE OF ADVANCED ELECTRONIC MAT

Overview
  • Total Patents
    29
  • GoodIP Patent Rank
    55,706
About

SHENZHEN INSTITUTE OF ADVANCED ELECTRONIC MAT has a total of 29 patent applications. Its first patent ever was published in 2019. It filed its patents most often in China. Its main competitors in its focus markets macromolecular chemistry and polymers, basic materials chemistry and semiconductors are SUZHOU XINGUANGYI ELECTRONICS CO LTD, HANSHAN JINZHONGHUAN DECORATION MAT CO LTD and SHENZHEN DARBOND INTERFACE MAT CO LTD.

Patent filings in countries

World map showing SHENZHEN INSTITUTE OF ADVANCED ELECTRONIC MATs patent filings in countries
# Country Total Patents
#1 China 29

Patent filings per year

Chart showing SHENZHEN INSTITUTE OF ADVANCED ELECTRONIC MATs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sun Rong 19
#2 Yang Chunlei 6
#3 Zhao Tao 6
#4 Zeng Xiaoliang 4
#5 Zhang Guoping 3
#6 Chen Ming 2
#7 Wang Zhongguo 2
#8 Zhang Weihao 2
#9 Zhang Baotan 2
#10 Liang Xianwen 2

Latest patents

Publication Filing date Title
CN112208173A Thermal interface material and preparation method thereof
CN112094573A Sprayable efficient electromagnetic shielding slurry and preparation method thereof
CN112111233A Thermosetting conductive shielding adhesive film and preparation method thereof
CN111969081A Preparation method of near-infrared detector
CN111961386A Heat radiation structure
CN111925654A Aluminum nitride and aluminum oxide compounded heat-conducting insulating silica gel material and preparation method thereof
CN111961255A Heat-conducting gel and preparation method thereof
CN111961314A Electronic packaging material and preparation method and application thereof
CN111883286A Preparation method of transparent conductive film and transparent conductive film
CN111992735A Silver nanowire and preparation method thereof
CN111925765A Epoxy resin composition and application thereof
CN111909638A Temporary bonding adhesive material for preventing wafer from being damaged by ultraviolet laser
CN111825867A Low-dielectric modified polyimide film and preparation method thereof
CN111816267A Simulation optimization method for grading of multi-particle-size particle filling system for composite material design
CN111883215A Three-dimensional space multi-particle filling dynamics simulation method
CN111763403A Liquid epoxy resin composition and preparation method and application thereof
CN111793476A Heat conduction material and preparation method thereof
CN111662666A High-frequency low-loss flexible insulating adhesive film material and preparation method and application thereof
CN111607227A Three-dimensional nano carbon/polyimide composite aerogel material and preparation method and application thereof
CN111693557A Quantitative characterization method for microstructure of tin-bismuth alloy welding spot