|
CN104448718A
|
|
Resin composition and application thereof
|
|
CN104589667A
|
|
Preparation method and application of bonding sheet for copper clad laminate
|
|
CN104237756A
|
|
Automated online testing method for voltage resistance of flaky material
|
|
CN103773266A
|
|
Adhesive and preparation method thereof as well as preparation technology of halogen-free aluminium base copper-clad plate based on adhesive
|
|
CN103770436A
|
|
Preparation method and application of halogen-free high-thermal-conductivity resin matrix composition
|
|
CN103450635A
|
|
Preparation method of epoxy resin composition with low dielectric constant
|
|
CN103193945A
|
|
Synthesis and application of resin for copper-clad plate
|
|
CN103192585A
|
|
Method for improving water absorbing capacity of copper-clad plate
|
|
CN103101252A
|
|
Method for manufacturing CEM (Composite Epoxy Material Grade)-3 copper-clad plate with high dielectric constant and low loss
|
|
CN103101253A
|
|
Copper surface processing technique for manufacturing thick copper-clad laminated board
|
|
CN101848604A
|
|
Preparation method of CEM-3 copper clad plate with high heat conductivity
|
