CN106967270A
|
|
A kind of halogen-free resin composition copper coated foil plate and preparation method thereof
|
CN106381113A
|
|
Adhesive used for high-heat resistance leadless low-dielectric copper-clad plate and preparation method thereof
|
CN106381110A
|
|
Adhesive for high-Tg, lead-free and low-dielectric type copper-clad plate and preparation method thereof
|
CN106364122A
|
|
Manufacturing method of high-Tg lead-free low-dielectric copper-foil-coated board
|
CN106433000A
|
|
Halogen-free resin composition and preparation method thereof
|
CN106166874A
|
|
Halogen-free copper-clad plate and preparation method thereof
|
CN106009532A
|
|
Halogen-free thermosetting resin composition as well as preparation method and application thereof
|
CN105415778A
|
|
Halogen-free high-frequency and high-speed copper-clad plate and preparation method thereof
|
CN105368001A
|
|
Halogen-free epoxy resin composition, preparation method therefor and application of halogen-free epoxy resin composition
|
CN104531008A
|
|
Adhesive suitable for high-Ta halogen-free low dielectric type copper-clad plate laminated substrate material and preparation method of material
|
CN104559888A
|
|
Copper-clad plate applicable to production of high multi-layer PCB (printed circuit board) and preparation method of copper-clad plate
|
CN104559068A
|
|
Thermosetting resin composition as well as preparation method and application thereof
|
CN104553229A
|
|
Preparation method of high-Tg halogen-free low-dielectric copper-clad plate
|
CN103642446A
|
|
Lead-free high heat-resisting copper-clad board and preparation method thereof
|
CN103802394A
|
|
Copper-clad plate suitable for lead-free process and preparation method of copper-clad laminate
|
CN103788576A
|
|
Epoxy resin composition and preparation method thereof
|
CN103044858A
|
|
Thermosetting resin composition, preparation method and use thereof
|
CN102975430A
|
|
Flame-retarding copper clad laminate coated with solid content containing phosphorous and no halogen and preparation method thereof
|
CN102964777A
|
|
Phosphorus-containing and halogen-free flame retardant resin adhesive as well as preparation method and application thereof
|
CN102492261A
|
|
Adhesive for producing common Tg lead-free copper foil-coated plates and preparation method for adhesive
|