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SHANGHAI NANYA COPPER CLAD LAMINATE CO LTD

Overview
  • Total Patents
    32
  • GoodIP Patent Rank
    135,455
About

SHANGHAI NANYA COPPER CLAD LAMINATE CO LTD has a total of 32 patent applications. Its first patent ever was published in 2006. It filed its patents most often in China. Its main competitors in its focus markets macromolecular chemistry and polymers, surface technology and coating and basic materials chemistry are NANYA NEW MATERIAL TECH CO LTD, NANTONG MAOXIN CRAFTS CO LTD and SHENGYI TECH (SHAANXI) CO LTD.

Patent filings in countries

World map showing SHANGHAI NANYA COPPER CLAD LAMINATE CO LTDs patent filings in countries
# Country Total Patents
#1 China 32

Patent filings per year

Chart showing SHANGHAI NANYA COPPER CLAD LAMINATE CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Zhang Dong 22
#2 Kuang Xiaojun 21
#3 Bao Xinyang 17
#4 Bao Xiuyin 16
#5 Xi Kuidong 16
#6 Su Junhua 12
#7 Dong Zhang 5
#8 Xiuyin Bao 4
#9 Zhu Jianguo 4
#10 Kuidong Xi 4

Latest patents

Publication Filing date Title
CN106967270A A kind of halogen-free resin composition copper coated foil plate and preparation method thereof
CN106381113A Adhesive used for high-heat resistance leadless low-dielectric copper-clad plate and preparation method thereof
CN106381110A Adhesive for high-Tg, lead-free and low-dielectric type copper-clad plate and preparation method thereof
CN106364122A Manufacturing method of high-Tg lead-free low-dielectric copper-foil-coated board
CN106433000A Halogen-free resin composition and preparation method thereof
CN106166874A Halogen-free copper-clad plate and preparation method thereof
CN106009532A Halogen-free thermosetting resin composition as well as preparation method and application thereof
CN105415778A Halogen-free high-frequency and high-speed copper-clad plate and preparation method thereof
CN105368001A Halogen-free epoxy resin composition, preparation method therefor and application of halogen-free epoxy resin composition
CN104531008A Adhesive suitable for high-Ta halogen-free low dielectric type copper-clad plate laminated substrate material and preparation method of material
CN104559888A Copper-clad plate applicable to production of high multi-layer PCB (printed circuit board) and preparation method of copper-clad plate
CN104559068A Thermosetting resin composition as well as preparation method and application thereof
CN104553229A Preparation method of high-Tg halogen-free low-dielectric copper-clad plate
CN103642446A Lead-free high heat-resisting copper-clad board and preparation method thereof
CN103802394A Copper-clad plate suitable for lead-free process and preparation method of copper-clad laminate
CN103788576A Epoxy resin composition and preparation method thereof
CN103044858A Thermosetting resin composition, preparation method and use thereof
CN102975430A Flame-retarding copper clad laminate coated with solid content containing phosphorous and no halogen and preparation method thereof
CN102964777A Phosphorus-containing and halogen-free flame retardant resin adhesive as well as preparation method and application thereof
CN102492261A Adhesive for producing common Tg lead-free copper foil-coated plates and preparation method for adhesive