|
CN111793327A
|
|
Epoxy resin composition for high-speed high-frequency copper-clad plate and preparation method thereof
|
|
CN111806001A
|
|
Preparation method of dip-soldering-resistant high-flexibility CEM-1 copper-clad plate
|
|
CN111572131A
|
|
Preparation method of CEM-1 copper-clad plate with high heat resistance and high reliability
|
|
CN111559139A
|
|
Preparation method of FR4 copper-clad plate with high relative tracking index and high thermal conductivity
|
|
CN111500021A
|
|
Preparation method of flame-retardant epoxy resin composite material
|
|
CN111531983A
|
|
High-heat-resistance low-dielectric copper-clad plate and preparation method thereof
|
|
CN111500249A
|
|
Low-dielectric-property low-water-absorption halogen-free copper-clad plate and preparation method thereof
|
|
CN111605269A
|
|
FR4 copper-clad plate with high relative tracking index and high heat resistance and preparation method thereof
|
|
CN111304709A
|
|
Surface treating agent for improving corrosion resistance of electrolytic copper foil
|
|
CN111349950A
|
|
Preparation method of carrier-attached ultrathin electrolytic copper foil
|
|
CN111364032A
|
|
Surface treating agent for copper foil for high-frequency high-speed copper-clad plate
|
|
CN110435254A
|
|
A kind of high heat resistance, high CTI CEM-3 copper-clad plate preparation method
|
|
CN110421928A
|
|
A kind of inexpensive, low-loss copper-clad plate the preparation method in high-speed high frequency field
|
|
CN110283428A
|
|
A kind of copper-clad plate halogen-free resin composition and preparation method thereof
|
|
CN110317433A
|
|
A kind of prepreg and preparation method thereof
|
|
CN110283427A
|
|
A kind of halogen-free epoxy resin prepreg and preparation method thereof
|
|
CN110317432A
|
|
A kind of high heat conduction metal-based copper-clad plate gluing and preparation method thereof
|
|
CN110283425A
|
|
A kind of epoxy resin prepreg and preparation method thereof
|
|
CN110029373A
|
|
A kind of compound additive for eliminating the unusual coarsening crystallization of electrolytic copper foil
|
|
CN110079840A
|
|
A kind of surface treatment additive package improving copper foil high-temp antioxidizing performance
|
