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SH COPPER PRODUCTS CO LTD

Overview
  • Total Patents
    69
  • GoodIP Patent Rank
    66,853
  • Filing trend
    ⇩ 50.0%
About

SH COPPER PRODUCTS CO LTD has a total of 69 patent applications. It decreased the IP activity by 50.0%. Its first patent ever was published in 2009. It filed its patents most often in Republic of Korea, China and Japan. Its main competitors in its focus markets materials and metallurgy, audio-visual technology and environmental technology are JIANGSU CAIFA ALUMINUM CO LTD, SHANGHAI HUAFON ALUMINUM CORP and NORTH CHINA ALUMINIUM CO LTD.

Patent filings in countries

World map showing SH COPPER PRODUCTS CO LTDs patent filings in countries

Patent filings per year

Chart showing SH COPPER PRODUCTS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Seki Satoshi 31
#2 Muroga Takemi 20
#3 Sawai Yoshiki 12
#4 Yamamoto Yoshiki 12
#5 Goto Chizuru 9
#6 Tonogi Tatsuya 9
#7 Tatsumi Noriyuki 7
#8 Kobayashi Ryuichi 6
#9 Ueda Koshiro 5
#10 Kodama Kenji 4

Latest patents

Publication Filing date Title
KR20150084670A Sputtering target meterial, method of manufacturing sputtering target material and wiring laminated body
CN104100831A Copper bar and manufacturing method thereof
CN103924118A Copper Alloy Material, Power Distribution Component For Electric Automobile, And Power Distribution Component For Hybrid Power Automobile
CN103255310A Rolled copper foil and preparation thereof
JP2013189702A Rolled copper foil and method of manufacturing the same
JP2013256682A Copper alloy foil, negative electrode for lithium ion secondary battery, lithium ion secondary battery, method of manufacturing copper alloy foil, and method of manufacturing negative electrode for lithium ion secondary battery
JP2013253309A Cu-Mn ALLOY SPUTTERING TARGET, LAMINATED WIRING OF SEMICONDUCTOR ELEMENT USING THE SAME, AND METHOD FOR MANUFACTURING LAMINATED WIRING
JP2013240803A Copper strip and manufacturing method for copper strip
JP2013230927A Wrinkle preventive method of long size sheet having surface frictional resistance
JP2013231224A Copper alloy material for electric and electronic components having excellent bending processability