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SEKISUI FULLER COMPANY LTD

Overview
  • Total Patents
    62
  • GoodIP Patent Rank
    26,568
  • Filing trend
    ⇧ 350.0%
About

SEKISUI FULLER COMPANY LTD has a total of 62 patent applications. It increased the IP activity by 350.0%. Its first patent ever was published in 2012. It filed its patents most often in WIPO (World Intellectual Property Organization), China and EPO (European Patent Office). Its main competitors in its focus markets macromolecular chemistry and polymers, basic materials chemistry and surface technology and coating are DINGLI NEW MATERIAL TECH CO LTD, THREE BOND FINE CHEMICAL CO LTD and HENKEL IRELAND LTD.

Patent filings per year

Chart showing SEKISUI FULLER COMPANY LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Someya Yu 18
#2 Murayama Yukihiko 14
#3 Kuwabara Shoji 12
#4 Kawabata Kazuhiro 12
#5 Ikeuchi Takuto 11
#6 Toda Tomoki 8
#7 Muramoto Tadashi 7
#8 Genma Rikio 7
#9 Suzuki Kazuya 6
#10 Koike Mamoru 6

Latest patents

Publication Filing date Title
WO2020149388A1 Crosslinkable block copolymer and hot-melt adhesive
WO2020149386A1 Crosslinkable block copolymer, production method therefor, and hot-melt adhesive
WO2020149385A1 Crosslinkable block copolymer and coating agent
WO2020149387A1 Crosslinkable block copolymer, production method therefor, and stretchable member
WO2020110921A1 Hot melt composition
WO2019235454A1 Hot-melt composition
WO2019235399A1 Thermoplastic resin film, meltable bag, and packaged hot-melt adhesive
CN112088189A Synthetic resin composition, refractory, sealing material, adhesive, and joint structure
WO2019171362A1 Thermally adhesive fibers, and resin composition for coating
WO2019151370A1 Method for producing stretchable laminate
WO2019151369A1 Elastic hot melt composition
WO2019131972A1 Hot melt adhesive
WO2019039611A1 Curable composition and joint structure obtained by using same
WO2019004376A1 Hot-melt adhesive
WO2018151190A1 Hot melt adhesive and stretchable laminate
WO2017138609A1 Uv curable acrylic polymer and method for producing same, and uv curable hot melt adhesive
WO2017047805A1 Curable resin composition
WO2018037497A1 Epoxy resin composition, potting material, and potting material for hollow-fiber membrane module
WO2016170796A1 Hot melt adhesives and disposable products using the same
WO2016093206A1 Uv-curable polymer, and uv-curable hot-melt adhesive containing same