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SEIDENSHA ELECTRONICS

Overview
  • Total Patents
    130
  • GoodIP Patent Rank
    50,309
  • Filing trend
    0.0%
About

SEIDENSHA ELECTRONICS has a total of 130 patent applications. It increased the IP activity by 0.0%. Its first patent ever was published in 1974. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets machines, machine tools and medical technology are INGLASS SPA, GREINER EXTRUSIONSTECHNIK GMBH and TECNOFIVE S R L.

Patent filings in countries

World map showing SEIDENSHA ELECTRONICSs patent filings in countries

Patent filings per year

Chart showing SEIDENSHA ELECTRONICSs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Matsugishi Noriaki 20
#2 Tsubone Shigemasa 20
#3 Watanabe Kimihiko 19
#4 Yonetani Kazuyuki 14
#5 Edahiro Yasunobu 9
#6 Kogashiwa Shigeru 8
#7 Nakajima Takashi 7
#8 Onozuka Yoshifumi 6
#9 Nagasawa Naokazu 6
#10 Aramata Yoshihiro 6

Latest patents

Publication Filing date Title
JP2020163848A Ultrasonic welding device
CN112074400A Ultrasonic welding method, structure welded by ultrasonic welding method, and ultrasonic welding apparatus
JP2020151831A Ultrasonic cutting device
JP2020146793A Obliquely cutting ultrasonic cutter device
JP2019000975A Ultrasonic cutter device
JP2019000974A Ultrasonic cutter device
JP2019192792A Gas laser oscillation method, gas laser oscillation device using this method, laser deposition device, and laser processing device
JP2019147348A High-frequency welding apparatus
JP2017216463A Carbon dioxide gas laser device
JP2018175482A Flexible tube and ultrasonic vibration welding method of resin mold, and ultrasonic vibration welding device
JP2017130680A Carbon dioxide gas laser excitation medium gas, marking device using carbon dioxide gas laser, carbon dioxide gas laser generation method, marking method using carbon dioxide gas laser, and carbon dioxide gas laser source
JP2018132106A High frequency dielectric deposition device for stepped tube and high frequency dielectric deposition method for stepped tube
JP2018001605A Laser deposition method of optical transparent resin and laser deposition device of optical transparent resin
JP2017047672A Heat caulking device
WO2017154113A1 Wire ultrasonic flexural vibration device, ultrasonic cutting device, ultrasonic washing device, ultrasonic separation device, ultrasonic accretion removal device, and balloon catheter device provided with ultrasonic accretion removal means
CN107405836A Laser soldering device and method for laser welding
WO2017037847A1 Heat caulking apparatus
JP2017013465A Ultrasonic wave seal device and ultrasonic wave seal method for the edge part of tube container
JP2016083853A Laser welding method and device of thermoplastic resin material
JP2016022533A Method and apparatus of manufacturing spring assembly