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SEHO SYSTEMTECHNIK GMBH

Overview
  • Total Patents
    82
  • GoodIP Patent Rank
    137,694
  • Filing trend
    0.0%
About

SEHO SYSTEMTECHNIK GMBH has a total of 82 patent applications. It increased the IP activity by 0.0%. Its first patent ever was published in 1991. It filed its patents most often in Germany, EPO (European Patent Office) and United States. Its main competitors in its focus markets machine tools, audio-visual technology and chemical engineering are IEMME ITALIA SPA, PILLARHOUSE INT LTD and KOKI TEC CORP.

Patent filings per year

Chart showing SEHO SYSTEMTECHNIK GMBHs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Walter Markus 38
#2 Ullrich Rudolf 24
#3 Diehm Rolf 23
#4 Herz Thomas 20
#5 Zoch Reiner 16
#6 Diehm Rolf Ludwig 15
#7 Liedke Volker 12
#8 Lettner Horst 9
#9 Schlembach Thomas 7
#10 Reinhardt Andreas 7

Latest patents

Publication Filing date Title
DE102019123294A1 Soldering nozzle and process for its manufacture
DE102018129201A1 Method and device for measuring the height of a solder wave
DE102017103205A1 Apparatus and method for reflow soldering
DE102016124642A1 Method and device for soldering assemblies
DE102016124641A1 soldering device
DE102014117617A1 soldering device
DE102014108042A1 Production plant for the assembly of electronic assemblies
DE102014106631A1 Apparatus and method for making solder joints
DE102014102455A1 Process for polymerizing a synthetic resin
WO2014086954A1 Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device
DE102013101124A1 Device and method for sintering a sintered product
DE102013100473A1 Method and device for cleaning a soldering nozzle
DE102012111946A1 Soldering device and method for selective soldering
DE102011001236A1 Method and device for tinning workpieces
DE102010007006A1 Method for soldering components comprising conductor plate and surface mount device-components, involves providing conductor plate that has pad areas for contacting components
WO2010031864A1 Reflow soldering device with a process chamber comprising a separating wall method for reflow soldering using such a reflow soldering device
DE102008020383A1 Method for attaching solar cell to conducting film to produce solar cell module, involves soldering contact points, where melted solder passes through clearance holes from bottom and connects conducting film and solar cells with one another
DE102008018360A1 Method for fitting solar cells on connecting support of solar cell module, involves connecting solar cells with connecting support, where connecting support is provided with conductive paths
DE102007042082A1 Device for soldering solar cells, comprises a laser soldering device, which is displaceably formed along a surface of the solar cell to be soldered, a holding-down device, a cooling device for cooling solder joints, and a camera
DE102007033865A1 Plant for flood-soldering components onto circuit boards, has gas blowing nozzle arrangement based on rotating shaft with helical groove in housing, to remove excess solder